Packaging Assembly Engineer

Benefits

Parental leave

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Non-birth-parent leave

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Family-building benefits

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Mental health support

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Relocation assistance

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Childcare support

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Learning budget

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Verification

Not verified last checked Jun 13, 2026

Salary

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401(k) match

Listed Source: EMPLR_CONTRIB_INCOME_AMT. source Last checked Jun 13, 2026.

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Schedule

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Weekend work

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Application

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Assessment

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Deadline

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Where they hire

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About this role

Packaging Assembly Engineer Austin Metro Area, United States of America Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC. Responsible to lead packaging assembly technology development. Work with cross functional team and lead SoC Package development efforts. Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging solution from concept to HVM. Drive industry with advanced Package solutions, new material development, and specs. Minimum 5% International travel. Define and optimize end‑to‑end FCBGA assembly process flow (wafer back‑end interface, flip‑chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection). Develop and maintain process documentation including process specs, work instructions, control plans, PFMEA, and process flow diagrams. Plan and execute DOEs to improve yield, quality, and cost; analyze data using SPC and other statistical tools, and drive closure on findings. Lead root‑cause analysis and corrective actions for assembly excursions, yield issues, and customer returns, in collaboration with quality, reliability, and FA teams. Partner with substrate and

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