Packaging Technical Leader

Benefits

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Family-building benefits

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Verification

Not verified last checked Jun 13, 2026

Salary

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401(k) match

Listed Source: EMPLR_CONTRIB_INCOME_AMT. source Last checked Jun 13, 2026.

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Schedule

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Weekend work

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Application

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About this role

Packaging Technical Leader San Jose, California, US The application window is expected to close on: 1/30/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received. Meet the Team Cisco is seeking a seasoned Packaging Technical Leader to join the Semi & Optics Packaging team within our world-class Supply Chain Organization. As a Technical Leader you will drive innovation in advanced packaging technology and quality for Cisco's cutting-edge ASIC and silicon photonic products. Your Impact You will operate at the intersection of advanced technology and strategic execution, working within a highly collaborative and multi-functional environment. This includes close partnerships with design engineering, operations, and supply chain teams to innovate next-generation technologies. You will also engage directly with counterparts at OSATs, Fabs, contract manufacturers and other key suppliers leading technical discussions and problem-solving efforts as well as influencing commodity strategy at a global scale. This role offers significant technical scope, cross-organizational visibility, and the potential to shape critical technology development and influence long-term product platforms. Key responsibilities: * Serve as a technical leader in advanced packaging technology (2.5D/3D, TSV, MCM, flip-chip, heterogenous integration). Oversee various aspects such as package assembly, process development, reliability qualification, materials and testing. * Work with top-tier package assembly partners to develop and qualify packaging solutions for Cisco products. * Multi-functional technical leadership to proactively identify and mitigate risks, and resolve highly complex packaging issues. Drive/support quality initiatives such as failure analysis (FA), root cause finding, and

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