RF/Microelectronics Packaging Engineer

Benefits

Parental leave

Not verified

Non-birth-parent leave

Not verified

Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

Not verified

Relocation assistance

Not verified

Childcare support

Not verified

Learning budget

Not verified

Verification

Not verified checked Jun 13, 2026

Salary

$156K-$246K From the posting source checked Jun 20, 2026

401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)

$116,543 U.S. median for this role

Projected growth (BLS Employment Projections)

+9.8% - Much faster than average

72% above the BLS role benchmark for software engineering aggregate.

Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

Engineering From the posting source checked Jun 20, 2026

Seniority

Mid From the posting source checked Jun 20, 2026

Schedule

Shift type

Not verified

Weekend work

Not verified

Company

Equity

Offered Verified - SEC 10-K source checked Jun 20, 2026

Application

Cover letter

Not verified

Assessment

Not verified

Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

RF/Microelectronics Packaging Engineer Tempe, Arizona About us One team. Global challenges. Infinite opportunities. At Viasat, we're on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We're looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team. What you'll do The Packaging Engineer position requires handling all aspects of packaging development. This means planning, crafting, and developing advanced or novel packaging. The role also involves managing packaging efforts related to radio frequency communication devices. The products range from IC's, System In Packages, sub-assemblies, and modules. The packaging development process includes package definition, stack-up, substrate layout, bond diagram, drawings, predictive modeling combined with system testing, technical risk/cost assessment, materials and process characterization, compilation of formal documentation, collaborating with sub-contractors and internal assembly and reliability resources, and final release of product. The day-to-day Job responsibilities include but not limited to: Working closely with project development teams and product groups (RFIC, MMIC, Module) to develop the next generation/sophisticated/novel packaging solution for RF communication products Define packages and materials that meet product requirements for reliability, performance, manufacturability, and cost. Ensure all packaging work is completed for New Product and New Technology Introductions Develop and manage packaging documentation including SOWs, package drawings, and process flows Build and layout of semiconductor packages including QFN, SiP, WL-CSP, RDL, Flip Chip, FO-WLP and Interposers Ensure

Read the full description at careers-viasat.icims.com. FewerJobs shows a preview and links to the original posting.