Photonic Packaging Engineer

Benefits

Parental leave

Not verified

Non-birth-parent leave

Not verified

Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

Not verified

Relocation assistance

Not verified

Childcare support

Not verified

Learning budget

Not verified

Verification

Not verified checked Jun 13, 2026

Salary

$134K-$225K From the posting source checked Jun 20, 2026

401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)

$116,543 U.S. median for this role

Projected growth (BLS Employment Projections)

+9.8% - Much faster than average

54% above the BLS role benchmark for software engineering aggregate.

Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

Engineering From the posting source checked Jun 20, 2026

Seniority

Mid From the posting source checked Jun 20, 2026

Work mode

Onsite From the posting source checked Jun 20, 2026

In-office days

5 days From the posting source checked Jun 20, 2026

Schedule

Shift type

Not verified

Weekend work

Not verified

Company

Company stage

Public-company From the posting source checked Jun 20, 2026

Equity

Offered Verified - SEC 10-K source checked Jun 20, 2026

Application

Cover letter

Not verified

Assessment

Not verified

Deadline

May 1, 2026 From the posting source checked Jun 20, 2026

Where they hire

State eligibility is not yet verified.

About this role

Photonic Packaging Engineer Carlsbad, California, US The application window is expected to close on: 05/01/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received . This is an onsite role and will require working out of our Carlsbad, CA office location. Meet the Team As a Photonic Packaging Engineer, you will play a key role in developing/supporting the next generation packaging platform for Cisco's Silicon Photonics Integrated Circuits and chipsets. You'll have the opportunity to work as a key member of the platform development team that is responsible for developing critical optical components, processes, and tools. Your Impact Design, Develop and Support Provide engineering support for Cisco's internally developed photonic assembly packaging tools. Gather and analyze data from Cisco's automated packaging tools/processes to shape new projects targeting improvement in novel subassemblies used in Cisco-designed high-volume manufacturing platforms. Recommend and implement test/assembly/process improvements, including cycle time reduction and automation of system to minimize required operator time and intervention. Design, build, and test prototypes of critical, complex electromechanical assemblies to be used in automated manufacturing/test tools. Diagnostics Development & Lifecycle Management Follow new tools, processes, and components from development to production to ensure successful integration of new platform technologies. Apply analytics and AI/ML to stimulate edge cases, optimize strategies, improve coverage, usability, debug capabilities and problem detection using structured problem-solving methodologies. Collaboration & Team Development Partner with hardware, software, and manufacturing teams to ensure multi-functional alignment and successful transition to manufacturing.

Read the full description at cisco.wd5.myworkdayjobs.com. FewerJobs shows a preview and links to the original posting.