ASIC Package Engineer

Benefits

Parental leave

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Non-birth-parent leave

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Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

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Relocation assistance

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Childcare support

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Learning budget

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Verification

Not verified last checked Jun 13, 2026

Salary

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401(k) match

Listed Source: EMPLR_CONTRIB_INCOME_AMT. source Last checked Jun 13, 2026.

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Market context

U.S. role benchmark (BLS OEWS)

$111,944 U.S. median for this role

Projected growth (BLS Employment Projections)

+13.7% - Much faster than average

Matched to SOC 15-1252 - Data and ML aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Schedule

Shift type

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Weekend work

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Application

Cover letter

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Assessment

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Deadline

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Where they hire

State eligibility is not yet verified.

About this role

ASIC Package Engineer Taipei, Taiwan Meet the Team We are seeking a skilled and driven ASIC Mechanical Engineer to join Cisco ASIC Group. In this role, you will focus on mechanical and thermomechanical simulations of ASICs and complex silicon packages. Your simulations will directly facilitate product design, ensure mechanical reliability, and accelerate time to market for high-performance Cisco systems. You will collaborate with a globally distributed team across multiple time zones, contributing to innovative, simulation-driven design across packaging, reliability, thermal, and hardware engineering groups. Your Impact · Perform finite element analysis to evaluate thermal mechanical stress, warpage, solder joint reliability of ASIC package, substrates, and advanced packaging assemblies. · Simulate and analyze linear/nonlinear material behaviors, such as plasticity, creep, and viscoelasticity, relevant to solder joints, Copper, stiffener, and underfills. · Develop and automate simulation workflows using Python, Fortran or similar scripting tools to streamline analysis and reporting. · Provide clear simulation results to support mechanical design, root cause analysis, and risk mitigation. · Support design optimization at early phase of product development and failure investigations by correlating FEA predictions with test data and field returns. · Document and present analysis results, assumptions, and design recommendations in a clear, structured format. Minimum Qualifications Bachelors + 7 years of related experience, or Masters + 4 years of related experience, or PhD + 1 years of related experience. At least 3 years of experience in mechanical design and thermomechanical simulation of semiconductor packages. Hands-on experience with 3D modeling, finite element analysis using ABAQUS

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