Substrate jobs

Associate Engineer (Thin Film) SGP - Science Park posted: Posted 30+ Days Ago

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Chemical Biologist US - MD, Bethesda posted: Posted 4 Days Ago

Assembler - Level 2 (Thin Film Inspector) M-F (5:00 am to 1:30 pm) San Jose, CA, United States Assembler - Level 2 (Thin Film Inspector) M-F (5:00 am to 1:30 pm) San Jose, CA, United States Job Description The Thin Film Inspector (Assembler) will perform inspection of Thin Film substrates, which includes packaging substrates and inspecting substrates under a microscope. The role also includes performing other Thin Film operations and running machines as requested. Responsibilities Responsibilities: Perform inspection of substrates under a microscope at low and high power and at different lighting settings. Package substrates of different shapes and sizes in waffle packs using tweezers. Understand and follow drawings, inspection criteria, written, and verbal instructions. Use measuring devices like video microscopes and calipers to measure dimensions. Apply inspection criteria and determine if a substrate is acceptable or rejectable. Maintain logs, fill out operation sheets, and record defects on reject logs and databases. Perform basic math and apply it to specifications. Perform other Thin Film operations and run machines as requested. Identify and communicate when substrates and processes do not meet specifications. Qualifications Day Shift - M-F (5:00 am to 1:30 pm) Pay Transparency The hourly pay range for this position is $26.15 - $32.70. Please note that this salary information serves as a general guideline. Honeywell considers various factors when extending an offer, including but not limited to the scope and responsibilities of the position, the candidate's work experience, education and training, key skills, as well as market and business

Assembler - Level 3 - (Thin Film) M- F (2:00 pm to 10:30 pm) San Jose, CA, United States Assembler - Level 3 - (Thin Film) M- F (2:00 pm to 10:30 pm) San Jose, CA, United States BE THE FIRST TO APPLY Job Description The Thin Film Operator (Assembler) will perform plating operations of thin film substrates. The role involves loading and unloading plating baths, measuring metal thickness and features, etching substrates, and working with wet benches. Responsibilities Responsibilities: Load and unload substrates into wet benches, ovens, plating baths, and dry etch machines. Determine plating current and times by using procedures and performing basic calculations. Perform automated and manual hand etching of substrates in wet benches. Inspect and touch up substrates under a microscope using knives and small hand tools. Measure metal thickness and features using X-rays, video microscopes, and semiautomated measurement scopes. Maintain logs, fill out operation sheets, and input data into databases. Understand and follow drawings, written, and verbal work instructions. Perform other tasks based on supervisor request. Identify and communicate when substrates and processes do not meet specifications. Qualifications Swing Shift - M-F (2pm-10:30pm) Pay Transparency The hourly pay range for this position is $26.15 - $32.70. Please note that this salary information serves as a general guideline. Honeywell considers various factors when extending an offer, including but not limited to the scope and responsibilities of the position, the candidate's work experience, education and training, key skills, as well as market and business considerations. U.S. PERSON

Materials Development Engineer 2 Locations posted: Posted 30+ Days Ago

Produce Processor Heavy Freshpoint Freshcuts posted: Posted 30+ Days Ago

Manager, Global Sourcing & Supply Management (GSSM) Cupertino, United States of America Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Apple is seeking a Manager, GSSM to lead a team that manages strategic planning, long term deal structuring and negotiations. This position requires the ability to work with procurement, engineering, finance and legal teams and also third-party suppliers. Position requires strong quantitative and analytical skills, critical thinking, and ability to manage multiple projects and deadlines simultaneously. - Team Development: Coach and mentor junior individual contributors to accelerate their onboarding across Apple-specific processes, supplier ecosystems, and stakeholder expectations. - Operational Continuity: The combined portfolio demands consistent senior oversight to cultivate deep relationships with substrate, resin, and raw material suppliers, drive negotiations, maintain execution quality, and ensure nothing falls through the cracks across concurrent work streams. - Industry Expertise : Develop advanced substrate technology expertise including FCBGA, Cored, Coreless, Hybrid, and HBS. - Complex Deal Support: The manager will lead or directly support high-complexity negotiations (new supplier MSAs, novel deal structures, long term strategic capex investments). - Strategic Initiatives: Formation and execution of substrate supply chain strategy to advance team wide priorities including cost modeling, new supplier development, and emerging technology investigations through deep engineering collaboration. - Scalability: As Gen AI capabilities advance, leverage AI Agents and tools to keep up with

Foundry Senior Engineer

Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging Austin, Texas, USA Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago-even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world. We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs. In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets. Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release. - Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar). - Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement. - Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers. - Support die-level RDL routing and bump planning in coordination with

Senior BIOS Engineer 2 Locations posted: Posted 30+ Days Ago

Senior Applications Engineer Troy, MI Requisition Number: 75138 The company built on breakthroughs. ​ Join us.​ Corning is one of the world's leading innovators in glass, ceramic, and materials science. From the depths of the ocean to the farthest reaches of space, our technologies push the boundaries of what's possible. ​ How do we do this? With our people. They break through limitations and expectations - not once in a career, but every day. They help move our company, and the world, forward. ​ ​At Corning, there are endless possibilities for making an impact. You can help connect the unconnected, drive the future of automobiles, transform at-home entertainment, and ensure the delivery of lifesaving medicines. And so much more.​ ​Come break through with us. Corning's Environmental Technologies segment manufactures ceramic substrates and filter products for emissions control in mobile and stationary applications around the world. Role Purpose Primary technical contact for the account Define and interpret the customer's technical roadmap and monitor their system progress (substrates, filters, catalysts, controls, operating window, etc.) Manage customer projects Define customer technology and quality requirements Coordinate and lead all customer validation projects Key Responsibilities Define, update, maintain Corning's technical account strategy for their customer Define and deploy Corning's current product/support portfolio that matches the customer's needs. Define gaps in those needs not met by current products

Thin Films Process Sustaining Engineer US, OR, Beaverton posted: Posted 30+ Days Ago

Applications Development Scientist - Inks Primary Background Country This is the role We are seeking an experienced Inks Applications Scientist with over 10 years of experience developing, formulating, and commercializing Inks. This role demands deep technical knowledge of ink formulations, raw materials, printing techniques, and substrates, combined with strategic leadership to drive innovation, cost optimization, and environmental stewardship. The successful candidate will serve as a subject matter expert, collaborating closely with R&D, marketing, sales teams, and customers to deliver high-performance materials for Inks applications that meet regulatory and market requirements. This position sits within Eastman's technology organization and provides support for our Coatings business organization. The position reports through the Group Leader Coatings Applications Development, located Ghent Belgium and is part of a global team. Job Responsibilities: • Provide technical leadership and mentorship on Inks properties, printing/application processes (e.g., Inkjet, Flexo, Gravure), performance testing and application requirements for various substrates. • Lead customer-facing projects regarding the design, development, and optimization of ink materials and formulations, including resins, solvents, additives, etc. • Drive innovation in sustainable solutions by evaluating new raw materials, bio-based solutions, and recyclable/compostable technologies. • Develop and maintain detailed testing specifications, technical documentation, and compliance req

Applied Scientist, Firefly Foundry 4 Locations posted: Posted Yesterday

Software Engineer (L3) Data Substrate Remote - US Who we are At Twilio, we're shaping the future of communications, all from the comfort of our homes. We deliver innovative solutions to hundreds of thousands of businesses and empower millions of developers worldwide to craft personalized customer experiences. Our dedication to remote-first work , and strong culture of connection and global inclusion means that no matter your location, you're part of a vibrant team with diverse experiences making a global impact each day. As we continue to revolutionize how the world interacts, we're acquiring new skills and experiences that make work feel truly rewarding. Your career at Twilio is in your hands. We use Artificial Intelligence (AI) to help make our hiring process efficient. That said, every hiring decision is made by real Twilions! . See yourself at Twilio Join the team as Twilio's next Software Engineer on our Data & Analytics Platform Who we are & why we're hiring Twilio powers real-time business communications and data solutions that help companies and developers worldwide build better applications and customer experiences. Although we're headquartered in San Francisco, we have presence throughout South America, Europe, Asia and Australia. We're on a journey to becoming a global company that actively opposes racism and all forms of oppression and bias. At Twilio, we support diversity, equity & inclusion wherever we do business. About the job We are looking for a talented and experienced Software Engineer to join our Data Platform team. In this role, you

Director - Materials Excellence 3 Locations posted: Posted 30+ Days Ago

Packaging Engineer United States Packaging Engineer

Manager, Silicon Supplier Quality 新北市, New Taipei City, Taiwan Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. As a Supplier Quality Engineer for Custom Silicon, you are the primary guardian of product integrity across our external manufacturing ecosystem. You will partner with Foundries, Substrate vendors, and OSAT partners to ensure bespoke chips meet the highest standards of reliability, yield, and performance. This role is remote based out of Taiwan. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are - 8+ years of expertise driving hardware or semiconductor quality across the full lifecycle-design, process, incoming, and supplier systems. - A Custom Silicon Specialist with deep experience in foundries, substrate manufacturing, and advanced packaging (2.5D/3D, Flip-Chip). - A "Zero-to-One" Builder who has experience transitioning companies from R&D to high-volume product delivery. - An Auditor & Strategist

Aricraft Painter Hialeah Gardens Who we are: AerSale® is a global leader and market innovator specializing in aviation products and services to meet the growing demand for aftermarket support in global passenger, cargo, and government segments. Featuring complete aircraft nose-to-tail, value-added offerings, including Aircraft & Component Maintenance, Repair and Overhaul Services (MRO), Aircraft & Engine Sales and Leasing, Used Serviceable Material (USM) Sales and Parts Exchange, Flight Equipment Asset Management Services, Internally developed aircraft and component modifications (engineered solutions) designed to enhance aircraft performance and operating economics (e.g. AerSale®, AerTrak® and AerAware). For more information, visit us at www.aersale.com. What we Offer: • Medical Insurance • 100% Employer Paid Dental, Vision, Life, Short and Long Term Disability Insurance • 401K with Employer Contribution • Employee Stock Purchase Plan (ESPP) • Education Reimbursement (related field) • Employee Referral Program and Recognition Program • Paid Holidays and 15 Paid Time-Off Days annually Job Description: Essential Duties and Responsibilities: • Proficient in spraying techniques and customizing chemical formulas to overcome environmental challenges and various substrates and environmental conditions. • Performs duties in compliance with regulations, including FAA, OSHA and EPA. • Be able to create complete paint prep work including chemical stripping and sanding on various forms of substrates (aluminum, composite, steel, stainless steel, etc.). • Proficient in tape masking of products and occasionally the use of body filler products and sanding techniques. • Completes aircraft paint detailing. • Additional other duties as assigned. Education and Experience: • High school diploma GED •

Technologist, Advanced Packaging Director 2 Locations posted: Posted 30+ Days Ago

Integrated Circuit Package Design Engineer Sunnyvale, CA, USA Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. As a Chip Package Designer, you will develop package substrate designs of advanced (2.5D/3.5D) packaging technologies for Machine Learning (ML) chips. This involves collaborating with SI/PI, thermal/mechanical, assembly, and PCB engineers to create complex, high-performance substrate designs. You will manage all phases of the design process, including routing feasibility, test vehicle creation, product designs, conducting design reviews, artwork export, DFM process and generating final documentation. Additionally, you will be instrumental in identifying and incorporating advanced chip packaging technologies into the Google chip product design pipeline. This contributes to successful chip deployment in data centers, ensuring the best optimized power, performance, area (PPA) designs and enhancing system performance relative to total cost of ownership (TCO ). Our team is responsible for designing and building the custom hardware, software, and networking technologies that power all of Google's services, as standard off-the-shelf hardware cannot meet our unique computational needs. You will be developing and building the systems that form the core of the world's largest and most powerful computing infrastructure. Your work will span from the fundamental levels of circuit design up to system design, seeing systems through to high-volume manufacturing, which directly influences the machinery in our

Installation Engineer Leixlip,IRL posted: Posted 13 Days Ago

Production Engineer 2 Locations posted: Posted 2 Days Ago