Assembler - Level 3 - (Thin Film) M- F (2:00 pm to 10:30 pm)

Benefits

Parental leave

Not verified

Non-birth-parent leave

Not verified

Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

Offered From the posting source checked Jun 20, 2026

Relocation assistance

Not verified

Childcare support

Not verified

Learning budget

Offered From the posting source checked Jun 20, 2026

Verification

Not verified checked Jun 7, 2026

Salary

$26.15-$32.7/hr From the posting source checked Jun 20, 2026

401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

Was this benefit information wrong? Tell us.

Market context

U.S. role benchmark (BLS OEWS)

$61,842 U.S. median for this role

Projected growth (BLS Employment Projections)

+1.9% - Slower

About in line with the BLS role benchmark for operations aggregate.

Matched to SOC 11-1021 - Operations aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

Operations From the posting source checked Jun 20, 2026

Seniority

Mid From the posting source checked Jun 20, 2026

Schedule

Shift type

Swing From the posting source checked Jun 20, 2026

Weekend work

Not verified

Company

Equity

Offered Verified - SEC 10-K source checked Jun 20, 2026

Application

Cover letter

Not verified

Assessment

Not verified

Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

Assembler - Level 3 - (Thin Film) M- F (2:00 pm to 10:30 pm) San Jose, CA, United States Assembler - Level 3 - (Thin Film) M- F (2:00 pm to 10:30 pm) San Jose, CA, United States BE THE FIRST TO APPLY Job Description The Thin Film Operator (Assembler) will perform plating operations of thin film substrates. The role involves loading and unloading plating baths, measuring metal thickness and features, etching substrates, and working with wet benches. Responsibilities Responsibilities: Load and unload substrates into wet benches, ovens, plating baths, and dry etch machines. Determine plating current and times by using procedures and performing basic calculations. Perform automated and manual hand etching of substrates in wet benches. Inspect and touch up substrates under a microscope using knives and small hand tools. Measure metal thickness and features using X-rays, video microscopes, and semiautomated measurement scopes. Maintain logs, fill out operation sheets, and input data into databases. Understand and follow drawings, written, and verbal work instructions. Perform other tasks based on supervisor request. Identify and communicate when substrates and processes do not meet specifications. Qualifications Swing Shift - M-F (2pm-10:30pm) Pay Transparency The hourly pay range for this position is $26.15 - $32.70. Please note that this salary information serves as a general guideline. Honeywell considers various factors when extending an offer, including but not limited to the scope and responsibilities of the position, the candidate's work experience, education and training, key skills, as well as market and business considerations. U.S. PERSON

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