Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging

Benefits

Parental leave

6 weeks From the posting source checked Jun 20, 2026

Non-birth-parent leave

6 weeks From the posting source checked Jun 20, 2026

Family-building benefits

• Fertility benefits: Offered From the posting source checked Jun 20, 2026
• Adoption assistance: Offered From the posting source checked Jun 20, 2026
• Surrogacy assistance: Not verified

Mental health support

Offered From the posting source checked Jun 20, 2026

Relocation assistance

Not verified

Childcare support

Offered From the posting source checked Jun 20, 2026

Learning budget

Not verified

Verification

Source-linked checked Jun 7, 2026

Salary

$136K-$184K From the posting source checked Jun 20, 2026

401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)

$116,543 U.S. median for this role

Projected growth (BLS Employment Projections)

+9.8% - Much faster than average

37% above the BLS role benchmark for software engineering aggregate.

Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

Engineering From the posting source checked Jun 20, 2026

Seniority

Mid From the posting source checked Jun 20, 2026

Schedule

Shift type

Not verified

Weekend work

Not verified

Company

Equity

Offered Verified - SEC 10-K source checked Jun 20, 2026

Application

Cover letter

Not verified

Assessment

Not verified

Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging Austin, Texas, USA Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago-even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world. We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs. In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets. Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release. - Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar). - Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement. - Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers. - Support die-level RDL routing and bump planning in coordination with

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