Sr Staff Package Design Engineer

Benefits

Parental leave

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Non-birth-parent leave

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Family-building benefits

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Mental health support

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Relocation assistance

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Childcare support

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Market context

U.S. role benchmark (BLS OEWS)

$111,944 U.S. median for this role

Projected growth (BLS Employment Projections)

+13.7% - Much faster than average

Matched to SOC 15-1252 - Data and ML aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Schedule

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Weekend work

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Application

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Deadline

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About this role

Sr Staff Package Design Engineer Tempe, Arizona, United States Company Description: Job Description: We are currently searching for a Sr. Staff Package Design Engineer. RESPONSIBILITIES : Design and develop hermetic/ceramic/metal and RAD (radiation) tolerant / class P plastic package and interconnect methods for Renesas's packaging needs in the areas of Commercial Space/ Aerospace, High Reliability power device packaging working with hermetic package suppliers NTK, Kyocera, Shinko. Familiarity with Mil Std 883, 38535, 750 specifications Define package technologies tooling & qualification for Commercial Space/ Aerospace, High Reliability Power Applications. Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT Outsourced Semiconductor Assembly & Test) or in-house assembly site (Palm Bay). Work with Renesas product designers to develop detailed package drawings for hermetic and plastic packages using AutoCAD. Work with OSAT (Outsourced Semiconductor Assembly & Test)/Palm Bay to run DOE to optimize processes and establish process specs. Work with Product groups and Reliability team, qualify new packages and processes within the required schedule from Product Engineer/Program manager. Develop and maintain technical expertise on advances and innovations in hermetic/ceramic/ metal and RAD tolerant / class P plastic packages. Participate in packaging roadmap development & focus on execution. Qualifications: Doctorate/Masters / Bachelor's degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering. 5-12 years of relevant experience in package development emphasizing hermetic/ceramic /metal and RAD tolerant / class P plastic package. Preferred understanding of semiconductor hermetic\plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SPC(Statistical

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