Sr. Staff - AI Data Center Architect
Coupang - Seoul, South Korea
Posted Jun 10, 2026
Benefits
- Parental leave
- Not verified
- Non-birth-parent leave
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- Family-building benefits
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- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
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- Relocation assistance
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- Childcare support
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- Learning budget
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- Verification
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- Salary
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Market context
- U.S. role benchmark (BLS OEWS)
- $111,944 U.S. median for this role
- Projected growth (BLS Employment Projections)
- +13.7% - Much faster than average
Matched to SOC 15-1252 - Data and ML aggregate by role bucket.
Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.
Role
Schedule
- Shift type
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- Weekend work
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Company
Application
- Cover letter
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- Assessment
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- Deadline
- Not stated
Where they hire
State eligibility is not yet verified.
About this role
Sr. Staff - AI Data Center Architect Seoul, South Korea Company Introduction We exist to wow our customers. We know we're doing the right thing when we hear our customers say, "How did we ever live without Coupang?" Born out of an obsession to make shopping, eating, and living easier than ever, we're collectively disrupting the multi-billion-dollar e-commerce industry from the ground up. We are one of the fastest-growing e-commerce companies that established an unparalleled reputation for being a dominant and reliable force in South Korean commerce. Our mission to build the future of commerce is real. We push the boundaries of what's possible to solve problems and break traditional tradeoffs. Join Coupang now to create an epic experience in this always-on, high-tech, and hyper-connected world. Role Overview You will lead the architectural vision for our next-generation data centers, transitioning our global footprint from traditional colocation models to high-density AI Factories. You are responsible for the physical and logical blueprint of the facility-ensuring that our "white space" can support 100kW+ racks, liquid-to-chip cooling, and the massive throughput requirements of 800G/1.6T networking. Responsibilities - Facility Strategy: Design the "Basis of Design" (BOD) for hyperscale facilities, including site selection, building massing, and modular "pod" scalability. - Thermal Management: Architect the transition from air-cooled data halls to Hybrid Cooling environments (Direct-to-Chip, Rear Door Heat Exchangers, and Immersion Cooling) to support high-TDP AI chips. - Power & Energy: Partner with electrical engineers to design high-availability power chains (N+1/2N) capable of supporting 50MW+ of IT
Read the full description at www.coupang.jobs. FewerJobs shows a preview and links to the original posting.
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