TSMC Technology Applications Engineer
Cisco - Zhubei, Taiwan
Posted May 12, 2026
Benefits
- Parental leave
- Not verified
- Non-birth-parent leave
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- Family-building benefits
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- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
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- Relocation assistance
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- Childcare support
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- Learning budget
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- Verification
- Not verified last checked Jun 13, 2026
- Salary
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- 401(k) match
- Listed Source: EMPLR_CONTRIB_INCOME_AMT. source Last checked Jun 13, 2026.
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Schedule
- Shift type
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- Weekend work
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Application
- Cover letter
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- Assessment
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- Deadline
- Not stated
Where they hire
State eligibility is not yet verified.
About this role
TSMC Technology Applications Engineer Zhubei, Taiwan The TSMC Technology Applications Engineer at Cisco will serve as the primary technical contact working with TSMC to support semiconductor technology tapeout and manufacturing processes. This role ensures smooth technology transfer, enhances processes, and supports product ramp-up to meet Cisco's semiconductor requirements. What You'll Do: Serve as the primary technical contact between Cisco and TSMC for manufacturing processes. Collaborate with TSMC counterparts and Cisco design teams to support volume production. Analyze and resolve manufacturing and process issues to improve yield, quality, and reliability. Facilitate technology-related knowledge transfer from TSMC to Cisco. Share technical knowledge with Cisco teams about TSMC technologies and processes. Coordinate projects involving TSMC and Cisco teams to drive continuous improvements. Manage shipments and logistics coordination with TSMC as needed. Minimum Qualifications: Bachelor's or Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, or a related field. 3+ years of experience in semiconductor manufacturing, technology applications, or supply chain coordination preferred. Strong analytical, problem-solving, and communication skills. Knowledge of semiconductor process technologies such as lithography, etching, deposition, and CMP. Ability to work effectively in a fast-paced, cross-functional environment with external partners. Skilled in data analysis, technical documentation, and project coordination. Preferred Qualifications : Familiarity with advanced semiconductor and advanced packaging nodes. Experience with process control, statistical analysis tools, and device physics. Understanding of supply chain logistics and inter-company transfer processes. Ability to manage multiple tasks and collaborate with global teams. We do not discriminate on the basis of race, religion, color, national
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