Cleanroom Assembler
Ametek - Work Location (Country) United States | Remote/Onsite Onsite
Posted Jun 12, 2026
Benefits
- Parental leave
- Not verified
- Non-birth-parent leave
- Not verified
- Family-building benefits
-
- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
- Not verified
- Relocation assistance
- Not verified
- Childcare support
- Not verified
- Learning budget
- Not verified
- Verification
- Not verified checked Jun 13, 2026
- Salary
- Not verified
- 401(k) match
- Reported from DOL Form 5500 industry filing (not employer-specific)
Was this benefit information wrong? Tell us.
Market context
- U.S. role benchmark (BLS OEWS)
- $61,842 U.S. median for this role
- Projected growth (BLS Employment Projections)
- +1.9% - Slower
Matched to SOC 11-1021 - Operations aggregate by role bucket.
Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.
Role
Schedule
- Shift type
- Not verified
- Weekend work
- Not verified
Company
- Equity
- Offered Verified - SEC 10-K source checked Jun 20, 2026
Application
- Cover letter
- Not verified
- Assessment
- Not verified
- Deadline
- Not stated
Where they hire
State eligibility is not yet verified.
About this role
Cleanroom Assembler Work Location (Country) United States | Remote/Onsite Onsite The Assembler will be responsible for the electrical/mechanical assembly and testing of products and associated components in a cleanroom environment. He or she will ensure that all products and components meet established specifications per standard operating procedures and/or mandated customer requirements. Key Responsibilities: Operating manual wire bonding and other cleanroom equipment: Setting up, calibrating, and operating manual wire bonders to perform ball and or wedge bonds with meticulous control. Precision wire bonding and assembly: Carefully manipulate and position the work holder under the bond head, creating the first bond, forming the wire loop, and creating the second bond. This requires excellent hand-eye coordination and precision under a microscope. Process parameter adjustment: Adjusting bonding parameters (e.g., bonding force, power, temperature, time, ball size, and height) as needed. Quality control and inspection: Inspecting components and wire bonds under a microscope to ensure they meet quality standards and specifications. Identifying and troubleshooting defects like damaged components, missing traces, wire breaks, golf balls, or non-sticking bonds. Equipment maintenance and troubleshooting: Performing routine maintenance on manual wire bonding machines, troubleshooting minor equipment malfunctions, and reporting more complex issues to the appropriate personnel. Cleanroom protocols and safety: Adhering to strict cleanroom procedures, electrostatic d
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