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Chip Design Engineer

Amazon - Tel Aviv-Yafo, Tel Aviv, ISR

Posted Apr 28, 2026

Benefits

Parental leave
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About this role

Chip Design Engineer Tel Aviv-Yafo, Tel Aviv, ISR AWS Utility Computing (UC) provides product innovations - from foundational services such as Amazon's Simple Storage Service (S3) and Amazon Elastic Compute Cloud (EC2), to consistently released new product innovations that continue to set AWS's services and features apart in the industry. As a member of the UC organization, you'll support the development and management of Compute, Database, Storage, Internet of Things (IoT), Platform, and Productivity Apps services in AWS, including support for customers who require specialized security solutions for their cloud services. Annapurna Labs, as part of AWS, is looking for an experienced engineer, to help us develop our cutting-edge semiconductor platform. You'll have the opportunity to join a top-tier, agile, fast-paced team, and take part in the development of the technology that powers the world's largest cloud provider. Amazon Web Services offers a highly reliable, scalable, low-cost cloud platform that enables hundreds of thousands of businesses in 190 countries around the world. We are looking for talented people to join the Chip Design team in TLV, working on the Nitro product line: https://aws.amazon.com/ec2/nitro/ Take an active, significant part in developing the next generations of products that will enable AWS to be the lead in the Cloud sector. Key job responsibilities * Full ownership of one or more IPs within the product: -Micro-architecture -RTL coding and debug -Synthesis and timing closure -Sign-off * Supporting the Verification and Emulation teams: Test plan, Coverage review * Ensuring that the chip meets quality and

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