FIELD APPLICATION ENGINEER I
TE Connectivity - Job Country United States
Posted Jun 12, 2026
Benefits
- Parental leave
- Not verified
- Non-birth-parent leave
- Not verified
- Family-building benefits
-
- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
- Not verified
- Relocation assistance
- Not verified
- Childcare support
- Not verified
- Learning budget
- Not verified
- Verification
- Not verified checked Jun 13, 2026
- Salary
- $69K-$104K From the posting source checked Jun 20, 2026
- 401(k) match
- Reported from DOL Form 5500 industry filing (not employer-specific)
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Market context
- U.S. role benchmark (BLS OEWS)
- $116,543 U.S. median for this role
- Projected growth (BLS Employment Projections)
- +9.8% - Much faster than average
26% below the BLS role benchmark for software engineering aggregate.
Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.
Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.
Role
Schedule
- Shift type
- Not verified
- Weekend work
- Not verified
Company
Application
- Cover letter
- Not verified
- Assessment
- Not verified
- Deadline
- Not stated
Where they hire
State eligibility is not yet verified.
About this role
FIELD APPLICATION ENGINEER I Job Country United States At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview Job Overview The Customer Process Field Engineer serves as a critical technical liaison between TE Connectivity and its customers, ensuring successful integration of TE's interconnect products into customer PCB and electronics manufacturing environments. This role combines manufacturing engineering, process optimization, and customer-facing support, with a strong emphasis on PCB assembly processes, SMT, and production readiness. Job Requirements Key Responsibilities • Develop deep expertise in how TE products are integrated within customer PCB manufacturing processes, including SMT and assembly workflows • Partner with customers and internal engineering teams to ensure alignment on application requirements, manufacturability, and process integration • Lead Design for Manufacturing (DFM) and Design for Assembly (DFA) discussions related to PCB applications and interconnect solutions • Support New Product Introduction (NPI) by conducting application and process readiness reviews, including formal sign-off between TE and customers • Collaborate with TE product and design engineering teams to incorporate real-world PCB process parameters into product specifications • Participate in and lead joint design and process reviews to ensure products meet manufacturing capability and performance requirements • Create and
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