Silicon Packaging Process Engineer, Production (Starlink)
SpaceX - Bastrop, TX
Posted Apr 29, 2026
Benefits
- Parental leave
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- Non-birth-parent leave
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- Family-building benefits
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- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
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- Relocation assistance
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- Childcare support
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- Learning budget
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- Salary
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- 401(k) match
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Schedule
- Shift type
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- Weekend work
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Application
- Cover letter
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- Assessment
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- Deadline
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Where they hire
State eligibility is not yet verified.
About this role
Silicon Packaging Process Engineer, Production (Starlink) Bastrop, TX SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. SILICON PACKAGING PROCESS ENGINEER, PRODUCTION (STARLINK) One of the most ambitious missions that SpaceX has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with packaging engineers, test engineers, equipment manufacturers, and leadership. The success of Starlink hinges on the quality, reliability, cost, manufacturability, throughput, and security of the products you deliver. If you thrive in a fast-paced environment, excel at solving difficult technical problems with outsized impact, and love building complex systems from the ground up, this role will be an ideal next step in your career. RESPONSIBILITIES: - Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer-level and chip-level systems - Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, surface mount technology (SMT), flip chip, bonding, molding, underfill, dispense, sputter, lid attach, solder ball attach, and advanced packaging processes - Own packaging prototypes, product development, release to
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