Dicing Specialist, Silicon Assembly (Starlink)
SpaceX - Bastrop, TX
Posted Jan 30, 2026
Benefits
- Parental leave
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- Non-birth-parent leave
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- Family-building benefits
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- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
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- Relocation assistance
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- Childcare support
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- Learning budget
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- Verification
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- Salary
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- 401(k) match
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Schedule
- Shift type
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- Weekend work
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Application
- Cover letter
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- Assessment
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- Deadline
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Where they hire
State eligibility is not yet verified.
About this role
Dicing Specialist, Silicon Assembly (Starlink) Bastrop, TX SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. DICING SPECIALIST, SILICON ASSEMBLY (STARLINK) One of the most ambitious missions that SpaceX has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with IC packaging engineers, test engineers, equipment manufacturers, and leadership. The success of Starlink depends on the quality, reliability, cost, manufacturability, throughput, and security of the products that you deliver. If you seek a fast-paced, dynamic environment; if you thrive on solving difficult problems where resolutions have high impact; and if you love the challenge of building something from scratch, then this role will be an ideal next career step. RESPONSIBILITIES: - Operate and program dicing equipment, including diamond saws, laser dicers & groovers, plasma dicers, and stealth dicing systems - Perform full-cut, partial-cut, or scribe-and-break processes on silicon wafers and large-format panels - Develop and refine dicing recipes by adjusting parameters such as blade speed, coolant flow, laser power, and feed rate to achieve clean edges, low die strength loss, and high dice-per-wafer efficiency
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