Sr. Wet Etch Process Development Engineer
Skywater Technology Inc - 200 NeoCity Wy, Kissimmee, FL 34744, USA
Posted Jun 12, 2026
Benefits
- Parental leave
- Not verified
- Non-birth-parent leave
- Not verified
- Family-building benefits
-
- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
- Not verified
- Relocation assistance
- Not verified
- Childcare support
- Not verified
- Learning budget
- Not verified
- Verification
- Not verified checked Jun 7, 2026
- Salary
- Not verified
- 401(k) match
- Reported from DOL Form 5500 industry filing (not employer-specific)
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Market context
- U.S. role benchmark (BLS OEWS)
- $111,944 U.S. median for this role
- Projected growth (BLS Employment Projections)
- +13.7% - Much faster than average
Matched to SOC 15-1252 - Data and ML aggregate by role bucket.
Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.
Schedule
- Shift type
- Not verified
- Weekend work
- Not verified
Company
- Equity
- Offered Verified - SEC 10-K source
Application
- Cover letter
- Not verified
- Assessment
- Not verified
- Deadline
- Not stated
Where they hire
State eligibility is not yet verified.
About this role
Sr. Wet Etch Process Development Engineer 200 NeoCity Wy, Kissimmee, FL 34744, USA Sr. Wet Etch Process Development Engineer 200 NeoCity Wy, Kissimmee, FL 34744, USA Posted Tuesday, June 2, 2026 Position Summary: We are looking for a hardworking and passionate Wet Etch Process Development and Integration Engineer for our Florida Advanced Packaging site. In this role you will lead, develop and improve processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management. Major Area of Accountability: • New process development/transfer/integration/ownership in a manufacturing environment. • Develop or integrate robust manufacturable process recipes for Foundry customers in Wet Etch / Cleans. • Lead one or more teams for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications. • Utilize metrology tools to characterize and document process results for transfer to production. • Investigate and drive integration changes for improved device performance and yield improvement. • Lead a team of process integration and tool engineers to find processing marginalities and make improvements. • Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by integration changes. • Monitor and improve electrical test parametrics through feedback and improvement to integration. • Directly interface with customers as a team
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