Process Engineering Manager - CMP, Dice, Grind & Bonding

Benefits

Parental leave

Not verified

Non-birth-parent leave

Not verified

Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

Not verified

Relocation assistance

Not verified

Childcare support

Not verified

Learning budget

Not verified

Verification

Not verified checked Jun 7, 2026

Salary

Not verified

401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

Was this benefit information wrong? Tell us.

Market context

U.S. role benchmark (BLS OEWS)

$116,543 U.S. median for this role

Projected growth (BLS Employment Projections)

+9.8% - Much faster than average

Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

Engineering From the posting source checked Jun 20, 2026

Seniority

Mid From the posting source checked Jun 20, 2026

Schedule

Shift type

Not verified

Weekend work

Not verified

Company

Company stage

Public-company From the posting source checked Jun 20, 2026

Equity

Offered Verified - SEC 10-K source checked Jun 20, 2026

Application

Cover letter

Not verified

Assessment

Not verified

Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

Process Engineering Manager - CMP, Dice, Grind & Bonding 200 NeoCity Wy, Kissimmee, FL 34744, USA Process Engineering Manager - CMP, Dice, Grind & Bonding 200 NeoCity Wy, Kissimmee, FL 34744, USA Posted Friday, June 5, 2026 Position Summary: The Process Engineering Manager - CMP, Dice, Grind and Bonding leads a team of process engineers and technical contributors responsible for wafer fabrication process development, sustaining, yield improvement, and technology transfer activities across assigned modules. This role provides senior technical and people leadership across chemical mechanical planarization, wafer dicing, grinding / thinning, wafer bonding, debonding, surface preparation, cleans, and related metrology in a cleanroom manufacturing environment. Primary Scope: CMP, post-CMP cleans, wafer dicing, grinding, thinning, backgrind, wafer bonding, debonding, surface preparation, related metrology, process control, sustaining, development, qualification, and transfer. People Leadership Expectations Serve as the direct people leader for an engineering team, with accountability for team performance, engagement, development, and execution against business priorities. Set clear goals, priorities, and expectations for individual contributors; ensure employees understand how their work supports fab, customer, program, and business objectives. Provide regular coaching, feedback, recognition, and career development support for employees at varying levels of experience. Build technical depth across the team by creating development plans, supporting knowledge sharing, strengthening process ownership, and delegating meaningful technical ownership. Assess team capability, identify skill gaps, and partner with leadership, HR, and Talent Acquisition on workforce planning, hiring, onboarding, retention, and succession planning. Create a culture of accountability, collaboration, safety, technical rigor, continuous improvement, and respectful communication.

Read the full description at jobs.dayforcehcm.com. FewerJobs shows a preview and links to the original posting.