Electroplating Engineer

Benefits

Parental leave

Not verified

Non-birth-parent leave

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Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

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Relocation assistance

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Childcare support

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Learning budget

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Verification

Not verified checked Jun 7, 2026

Salary

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401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)

$111,944 U.S. median for this role

Projected growth (BLS Employment Projections)

+13.7% - Much faster than average

Matched to SOC 15-1252 - Data and ML aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

Data From the posting source

Seniority

Mid From the posting source

Schedule

Shift type

Not verified

Weekend work

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Company

Equity

Offered Verified - SEC 10-K source

Application

Cover letter

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Assessment

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Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

Electroplating Engineer 200 NeoCity Wy, Kissimmee, FL 34744, USA Electroplating Engineer 200 NeoCity Wy, Kissimmee, FL 34744, USA Posted Tuesday, June 2, 2026 Position Summary: We are looking for a hardworking and passionate Electroplating Process Development Engineer for our Florida Advanced Packaging site working with copper, nickel, SnAg and gold plating. In this role you will develop and improve processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management. Major Area of Accountability: • Own overall responsibility for plating process development area, drive improvements in process, documentation, training with new process development/transfer in a manufacturing environment. • Develop or integrate robust manufacturable process recipes for Foundry customers in Copper, Nickel, Gold, or SnAg electroplating, wet etch chemistry and wet cleans. • Lead or work in a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications. • Utilize metrology tools to characterize and document process results for transfer to production including CVS measurements, bath analysis and additions, thickness and fill characteristics. • Investigate and drive integration changes for improved device performance and yield improvement. • Work with process integration and tool engineers to find processing marginalities and make improvements. • Routinely monitor selected in-line and end-of-line SPC charts for trends or

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