Advanced Packaging Process Development Engineer - Staff

Benefits

Parental leave

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Non-birth-parent leave

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Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

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Relocation assistance

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Childcare support

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Learning budget

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Verification

Not verified checked Jun 7, 2026

Salary

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401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)

$111,944 U.S. median for this role

Projected growth (BLS Employment Projections)

+13.7% - Much faster than average

Matched to SOC 15-1252 - Data and ML aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

Data From the posting source

Seniority

Mid From the posting source

Schedule

Shift type

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Weekend work

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Company

Equity

Offered Verified - SEC 10-K source

Application

Cover letter

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Assessment

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Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

Advanced Packaging Process Development Engineer - Staff 200 NeoCity Wy, Kissimmee, FL 34744, USA Advanced Packaging Process Development Engineer - Staff 200 NeoCity Wy, Kissimmee, FL 34744, USA Posted Wednesday, June 3, 2026 Position Summary: As an Advanced Packaging Process Engineer, you will own all assigned process steps. The preferred candidate will have the ability to troubleshoot difficult and poorly defined problems in relation to the specific process disciplines assigned using tool knowledge/experience, SPC, qualifying data, and other available resources. The candidate will have extensive collaboration with the area maintenance team and equipment engineering. Some collaboration will be with tool vendors, other area engineers/managers, procurement, integration, and production. If you are a self-motivated team player, who thrives in a fast-paced, constantly changing environment, passionate about building great products and learning new technologies, this is the job for you! Major Areas of Accountability: Provide technical leadership and management of Advanced Packaging Semiconductor processes in Support of Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding. Highly desirable for a candidate to have a background in at least one of the following areas: Wafer Singulation, Solder Bumping, Maskless Photolithography, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test (some areas may be combined). Work with equipment engineering and equipment maintenance technicians to drive root cause corrective actions of equipment failures, implement permanent solutions, and eliminate chronic and long-term down events. Collaborate with continuous improvement teams

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