Director, Semiconductor IC Packaging & Assembly Engineering

Benefits

Parental leave

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Non-birth-parent leave

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Family-building benefits

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• Surrogacy assistance: Not verified

Mental health support

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Relocation assistance

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Childcare support

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Learning budget

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Verification

Not verified checked Jun 7, 2026

Salary

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401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)

$111,944 U.S. median for this role

Projected growth (BLS Employment Projections)

+13.7% - Much faster than average

Matched to SOC 15-1252 - Data and ML aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

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Seniority

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Schedule

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Weekend work

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Application

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Assessment

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Deadline

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Where they hire

State eligibility is not yet verified.

About this role

Director, Semiconductor IC Packaging & Assembly Engineering Shah Alam, , Malaysia Company Description: Job Description: We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional scope spanning wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This leader will oversee yield performance, process stability, quality control, process change management, and manufacturing readiness while partnering closely with Package Engineering, R&D, Product Engineering, Quality, Supply Chain, and external OSAT partners to successfully transition New Product Introduction (NPI) programs into scalable high-volume manufacturing (HVM). The ideal candidate combines deep semiconductor packaging assembly expertise with strong operational leadership, data-driven decision-making, and cross-functional collaboration skills to drive manufacturing excellence, product quality, and continuous improvement across global operations. This role also serves as a critical interface to Director, Package Engineering by ensuring package development intent, qualification requirements, process windows, and ramp readiness are translated effectively into stable, cost-competitive, high-volume manufacturing execution. Key Responsibilities Manufacturing & Sustaining Engineering Leadership Lead sustaining engineering across semiconductor package assembly technologies and product lines. Drive high-volume manufacturing performance in yield, cycle time, quality, throughput, and cost. Establish strong engineering systems for process control, defect reduction, and continuous improvement. Align assembly engineering roadmaps with business growth and package technology strategies. Partner with Package Engineering

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