Senior Package Design Engineer

Benefits

Parental leave

Not verified

Non-birth-parent leave

Not verified

Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

Not verified

Relocation assistance

Not verified

Childcare support

Not verified

Learning budget

Not verified

Verification

Not verified checked Jun 13, 2026

Salary

$111K-$206K not verified - source not recorded; timestamp not recorded

401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)

$111,944 U.S. median for this role

Projected growth (BLS Employment Projections)

+13.7% - Much faster than average

U.S. benchmark only; posted salary is not compared across countries or currencies.

Matched to SOC 15-1252 - Data and ML aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

Data Verified - recorded source

Seniority

Senior Inferred - source not recorded

Schedule

Shift type

Not verified

Weekend work

Not verified

Company

Equity

Offered Verified - SEC 10-K source

Application

Cover letter

Not verified

Assessment

Not verified

Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

Senior Package Design Engineer San Jose, CA, US; Taipei, UNAVAILABLE, TW Overview Rambus, a premier chip and silicon IP provider making data faster and safer, is seeking to hire an exceptional Senior Package Design Engineer to join our Package Engineering team in San Jose, CA. In this role, you will be working with some of the brightest inventors and engineers in the world developing products that make data faster and safer. This is a full-time position reporting to the Director of Package Engineering. As a Senior Package Design Engineer, you will be responsible for supporting the design and layout of new products from early concept to tape out, focusing primarily on several elements that enable high-yielding, low defectivity production. The Senior Package Design Engineer will have the opportunity to work with multiple package technologies and outsourced suppliers to ensure manufacturing readiness for the Rambus product portfolio. Rambus offers a flexible work environment, embracing a hybrid approach for most office-based roles. Employees are encouraged to spend an average of at least three days per week onsite, allowing for two days of remote work. Responsibilities Drive early chip-package co-design and development of bump and ball map. Own layout of package types such as FCCSP, FCBGA, FCQFN, WLCSP, QFN. Collaborate with multiple cross-functional teams (Chip Design, SI/PI, Packaging) Analyze cost/performance/reliability trade-offs to complete layout of new products and test chips. Interact with OSAT partners and substrate/leadframe suppliers for design reviews and execution. Continuous improvement of package design workflow and unified package design guidelines.

Read the full description at careers-rambus.icims.com. FewerJobs shows a preview and links to the original posting.