Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Verified benefits

Parental leave

12 weeks source

Non-birth-parent leave

12 weeks

Verified

Yes last checked unknown

Salary

Not disclosed

Market context

Median wage (BLS OEWS)

$116,543 national median

Projected growth (BLS Employment Projections)

+9.8% - Much faster than average

Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Where they hire

State eligibility is not yet verified.

About this role

Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering Fab 10A, Singapore Our vision is to transform how the world uses information to enrich life for all. Join

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