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Packaging Module Development Engineer

Intel - US, Arizona, Phoenix

Posted May 5, 2026

Verified benefits

Parental leave
12 weeks
Non-birth-parent leave
12 weeks
Verified
Yes last checked unknown
Salary
Not disclosed
401(k) match
Not verified

Market context

Median wage (BLS OEWS)
$116,543 national median
Projected growth (BLS Employment Projections)
+9.8% - Much faster than average

Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Where they hire

State eligibility is not yet verified.

About this role

Packaging Module Development Engineer US, Arizona, Phoenix Packaging Module Development Engineer /job/US-Arizona-Phoenix/Packaging-Module-Development-Engineer_JR0283134-1 US, Arizona, Phoenix Posted Yesterday

Read the full description at intel.wd1.myworkdayjobs.com. FewerJobs shows a source-linked preview and links to the original posting.

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