Senior TPU RTL Design Engineer, Networking, Inter-Chip Interconnects

Benefits

Parental leave

18 weeks From the posting source checked Jun 20, 2026

Non-birth-parent leave

18 weeks From the posting source checked Jun 20, 2026

Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

Not verified

Relocation assistance

Not verified

Childcare support

Not verified

Learning budget

Not verified

Verification

Source-linked checked May 7, 2026

Salary

$163K-$237K From the posting source checked Jun 20, 2026

401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)

$116,543 U.S. median for this role

Projected growth (BLS Employment Projections)

+9.8% - Much faster than average

72% above the BLS role benchmark for software engineering aggregate.

Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

Engineering From the posting source checked Jun 20, 2026

Seniority

Senior From the posting source checked Jun 20, 2026

Schedule

Shift type

Not verified

Weekend work

Not verified

Company

Equity

Offered Verified - SEC 10-K source checked Jun 20, 2026

Application

Cover letter

Not verified

Assessment

Not verified

Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

Senior TPU RTL Design Engineer, Networking, Inter-Chip Interconnects Sunnyvale, CA, USA In this role, you will work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers Google's most demanding AI/ML applications. You'll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems. Join the team designing and developing the core components of Google's next-generation Tensor Processing Units (TPUs), the custom-built accelerators powering our AI and machine learning workloads in data centers. As a member of the inter-chip interconnect team, you will play an important role in designing ASIC/SoC hardware for AI and networking accelerators that drive the computational workloads behind Google's most important products. Our hardware accelerators power nearly every product Google offers. Our primary focus is AI acceleration. You will design RTL IP with a focus on chip-to-chip high-speed interconnect subsystems. You will have dynamic, multi-faceted responsibilities in areas such as project definition, RTL design, and implementation. You will participate in the design, architecture, documentation, and implementation of the next generation of data center accelerators. You will have the opportunity to solve challenging technical problems at the forefront of AI hardware, working in a dynamic and collaborative environment. The AI

Read the full description at www.google.com. FewerJobs shows a preview and links to the original posting.