Advanced Packaging SI/PI Engineer

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About this role

Advanced Packaging SI/PI Engineer San Jose, CA, United States About Etched Etched is building the world's first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history. Job Summary As a Signal & Power Integrity Engineer you will be responsible for the electrical performance of our AI accelerator platform across silicon, package, and board. The ideal candidate will have extensive experience with high-power package and board designs, robust power delivery networks, and high-speed signaling solutions in advanced packaging. You will work closely with silicon, package, platform, and system teams to co-design world-class platforms with OSAT and ODM partners. Intense focus on pushing what is possible in power delivery and high-speed signaling for transformer-purposed silicon. Key Responsibilities - SI/PI analysis of designs and optimization within 2D/2.5D/3D packages - Close interaction with Package Layout Designers, ASIC PD and IP teams as well as Board Schematic/Layout/SI/PI teams to optimize the best electrical performance - Drive SI requirements into interposer/substrate layout (high-speed routing: 112G/224G) from preliminary design through tape-out. - Drive PDN design and decoupling strategy across substrate and interposer, owning DC IR drop, dynamic IR drop, and impedance targets across

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