Principal Package Thermal & Mechanical Engineer

Benefits

Parental leave

Not verified

Non-birth-parent leave

Not verified

Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

Not verified

Relocation assistance

Not verified

Childcare support

Not verified

Learning budget

Not verified

Verification

Not verified

Salary

Not verified not verified - source not recorded; timestamp not recorded

401(k) match

Not verified

Was this benefit information wrong? Tell us.

Market context

Median wage (BLS OEWS)

$116,543 national median

Projected growth (BLS Employment Projections)

+9.8% - Much faster than average

78% above the BLS national median for software engineering aggregate.

Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Schedule

Shift type

Not verified

Weekend work

Not verified

Application

Cover letter

Not verified

Assessment

Not verified

Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

Principal Package Thermal & Mechanical Engineer San Jose, California, United States Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs' Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company's custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com . Role Overview As a Principal Package Thermal & Mechanical Engineer at Astera Labs, you will serve as a technical leader driving the development and modeling of advanced IC packaging solutions that enable next-generation AI and high-performance connectivity systems. In this highly visible role, you will define and execute thermal and mechanical modeling strategies across the chip-package-board system, influencing package architecture, material selection, and reliability design. You will partner closely with package design, SIPI, silicon, system, and manufacturing teams to ensure robust thermal/mechanical performance and first-pass success. You will also drive modeling methodologies, correlation strategies, and best-known methods (BKMs), while engaging directly with customers to translate complex simulation insights into actionable system-level solutions. Key Responsibilities - Thermal & Mechanical Modeling Leadership - Define and drive thermal and mechanical modeling strategies for advanced packages (FCBGA, FCCSP, multi-die, and chiplet-based architectures) - Perform detailed thermal simulations including steady-state and

Read the full description at job-boards.greenhouse.io. FewerJobs shows a source-linked preview and links to the original posting.