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Photonic Packaging Engineer, Principal

Astera Labs - San Jose, California, United States

Posted May 19, 2026

Benefits

Parental leave
Not verified
Non-birth-parent leave
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Family-building benefits
  • Fertility benefits: Not verified
  • Adoption assistance: Not verified
  • Surrogacy assistance: Not verified
Mental health support
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Relocation assistance
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Childcare support
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Learning budget
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Verification
Not verified checked Jun 7, 2026
Salary
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401(k) match
Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)
$116,543 U.S. median for this role
Projected growth (BLS Employment Projections)
+9.8% - Much faster than average

Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function
Engineering From the posting source checked Jun 20, 2026
Seniority
Principal From the posting source checked Jun 20, 2026

Schedule

Shift type
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Weekend work
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Company

Company stage
Public-company From the posting source checked Jun 20, 2026
Equity
Offered Verified - SEC 10-K source checked Jun 20, 2026

Application

Cover letter
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Assessment
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Deadline
Not stated

Where they hire

State eligibility is not yet verified.

About this role

Photonic Packaging Engineer, Principal San Jose, California, United States Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs' Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company's custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com . We are seeking a visionary and technically strong Photonic Packaging Engineer, Principal to lead the design, development, and productization of advanced packaging solutions for advanced optics. This role will drive the intersection of photonics, high-speed electronics, thermal management, and mechanical integration to enable next-generation data center and networking platforms. You will guide a multidisciplinary team through all phases of product realization-from concept and design through manufacturing scale-up-working closely with silicon photonics, electrical packaging, systems, and supply chain teams to achieve world-class optical and electrical performance. Key Responsibilities - Lead the end-to-end development of photonic packaging strategies for Silicon Photonics Modules, including EIC/PIC co-packaging, optical coupling, fiber attach, and thermal and mechanical design. - Define technical requirements and package architectures that balance performance, manufacturability, and cost with compatibility with established electronic packaging flows. - Collaborate with IC packaging, optical connector, and silicon photonics teams to achieve co-design optimization -

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