Photonic Packaging Engineer, Principal
Astera Labs - San Jose, California, United States
Posted May 19, 2026
Benefits
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- Family-building benefits
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About this role
Photonic Packaging Engineer, Principal San Jose, California, United States Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs' Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company's custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com . We are seeking a visionary and technically strong Photonic Packaging Engineer, Principal to lead the design, development, and productization of advanced packaging solutions for advanced optics. This role will drive the intersection of photonics, high-speed electronics, thermal management, and mechanical integration to enable next-generation data center and networking platforms. You will guide a multidisciplinary team through all phases of product realization-from concept and design through manufacturing scale-up-working closely with silicon photonics, electrical packaging, systems, and supply chain teams to achieve world-class optical and electrical performance. Key Responsibilities - Lead the end-to-end development of photonic packaging strategies for Silicon Photonics Modules, including EIC/PIC co-packaging, optical coupling, fiber attach, and thermal and mechanical design. - Define technical requirements and package architectures that balance performance, manufacturability, and cost with compatibility with established electronic packaging flows. - Collaborate with IC packaging, optical connector, and silicon photonics teams to achieve co-design optimization -
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