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Substrate Technologist

Apple - San Francisco Bay Area, United States of America

Posted Jun 4, 2026

Benefits

Parental leave
Not verified
Non-birth-parent leave
Not verified
Family-building benefits
  • Fertility benefits: Not verified
  • Adoption assistance: Not verified
  • Surrogacy assistance: Not verified
Mental health support
Not verified
Relocation assistance
Not verified
Childcare support
Not verified
Learning budget
Not verified
Verification
Not verified checked Jun 13, 2026
Salary
$172K-$302K From the posting source checked Jun 20, 2026
401(k) match
Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)
$116,543 U.S. median for this role
Projected growth (BLS Employment Projections)
+9.8% - Much faster than average

103% above the BLS role benchmark for software engineering aggregate.

Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function
Engineering From the posting source checked Jun 20, 2026
Seniority
Mid From the posting source checked Jun 20, 2026

Schedule

Shift type
Not verified
Weekend work
Not verified

Company

Equity
Offered Verified - SEC 10-K source checked Jun 20, 2026

Application

Cover letter
Not verified
Assessment
Not verified
Deadline
Not stated

Where they hire

State eligibility is not yet verified.

About this role

Substrate Technologist San Francisco Bay Area, United States of America At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation product package structure and configuration optimization. You will be responsible for Apple Package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with a cross-functional team to achieve the best package performance. - Lead RFSIP package substrate development, pathfinding technology, and roadmap definition. - Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM. - Work across a variety of cross-functional groups directly and involve themselves in engineering and product development. - Drive industry with sophisticated package solutions, new material development, and specs. - 5% International travel. Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap. Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability etc. Problem solving of technical issues during the full product development cycle. Minimum Qualifications: BS and 10+ years of relevant industry experience. Preferred Qualifications: MS or Ph.D. and 5+ years of relevant industry experience. Proven fundamentals

Read the full description at jobs.apple.com. FewerJobs shows a preview and links to the original posting.

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Apply link not verified; last-live date unavailable.

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