SOC Thermal Engineer
Apple - Austin, United States of America
Posted Oct 15, 2025
Benefits
- Parental leave
- Not verified
- Non-birth-parent leave
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- Family-building benefits
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- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
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- Relocation assistance
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- Childcare support
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- Learning budget
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- Verification
- Not verified last checked Jun 13, 2026
- Salary
- Not verified not verified - source not recorded; timestamp not recorded
- 401(k) match
- Listed Source: EMPLR_CONTRIB_INCOME_AMT. source Last checked Jun 13, 2026.
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Schedule
- Shift type
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- Weekend work
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Application
- Cover letter
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- Assessment
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- Deadline
- Not stated
Where they hire
State eligibility is not yet verified.
About this role
SOC Thermal Engineer Austin, United States of America Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device's thermal performance and participate in advanced IC packaging research and development. The Thermal Engineer will design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines. This position is responsible for thermal analysis and design of thermal solutions to address chip energy efficiency and performance scaling, Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Analyzing simulation and measurement results to enhance product thermal management, Integrate cooling solutions to next generation SOC architecture design. Minimum Qualifications: BS + 10 years of industry experience. Preferred Qualifications: MSEE +10 years of industry experience. Demonstrated leadership capabilities at the senior engineer level. Deep expertise in thermal design for silicon devices and packaging solutions. Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies. Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches. Comprehensive knowledge
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