Package Integration Engineer

Benefits

Parental leave

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Non-birth-parent leave

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Family-building benefits

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Not verified last checked Jun 13, 2026

Salary

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401(k) match

Listed Source: EMPLR_CONTRIB_INCOME_AMT. source Last checked Jun 13, 2026.

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Schedule

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Weekend work

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Application

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About this role

Package Integration Engineer San Francisco Bay Area, United States of America Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets. • In this fast-paced environment, your role is to interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new packaging technologies. • We are looking for individuals who are very innovative with a proven track record to Define new package characteristics based on unique module and system level performance, cost, and footprint requirements. Define package/packaging specifications. Work with suppliers on package design, new material, new equipment selection and process/process flow development. Perform initial proof of concept sample build, POR establishment, package and process qualification, reliability test, yield analysis and enhancement. Coordinate with other packaging and cross-functional team members to comply with product development/ramp schedule. Deliver package/packaging milestones on time. Define packaging roadmap based on long term packaged product requirements. Work closely and Manage suppliers' R&D activities. Minimum Qualifications: BS and 10+ years of relevant industry experience. Preferred Qualifications: M.S or Ph.D. degree in mechanical engineering, physics, materials science or similar disciplines with a minimum of 10 years of experience in IC packaging. AutoCAD, APD and multi-physics simulation knowledge is a plus. Some hands-on knowledge in Wafer Bumping, Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach (including multilayer thin die stacking), encapsulation/molding, under-fill, ball attach, package singulation and Tape

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