IC Packaging Simulation Engineer

Benefits

Parental leave

Not verified

Non-birth-parent leave

Not verified

Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

Not verified

Relocation assistance

Not verified

Childcare support

Not verified

Learning budget

Not verified

Verification

Not verified checked Jun 13, 2026

Salary

$181K-$318K From the posting source checked Jun 20, 2026

401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

Was this benefit information wrong? Tell us.

Market context

U.S. role benchmark (BLS OEWS)

$116,543 U.S. median for this role

Projected growth (BLS Employment Projections)

+9.8% - Much faster than average

114% above the BLS role benchmark for software engineering aggregate.

Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

Engineering From the posting source checked Jun 20, 2026

Seniority

Mid From the posting source checked Jun 20, 2026

Schedule

Shift type

Not verified

Weekend work

Not verified

Company

Company stage

Public-company From the posting source checked Jun 20, 2026

Equity

Offered Verified - SEC 10-K source checked Jun 20, 2026

Application

Cover letter

Not verified

Assessment

Not verified

Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

IC Packaging Simulation Engineer Austin Metro Area, United States of America Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM simulation with multi-year FEM software ANSYS or ABAQUS. This position requires someone familiar with development process of simulation and characterization projects, that thrives in a multifaceted collaborative organization. In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. You will also be working on scripting CAD/FEM software, and Generative-AI/Machine Learning/numerical tools to set up automated model-generation user interfaces. Numerical modeling of the stress and deformation of component packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. Actively exploring the feasibility during product package definition and identifying risks of reliability and product yield through simulation. Supporting new product introduction (NPI), solving problems emerging from product development and manufacturing. Programming or scripting CAD/FEM software, and Gen-AI/ML/numerical tools to set up automated model-generation user interfaces and maintain those codes. Minimum Qualifications: BS and a minimum of 10 years relevant industry experience or equivalent Preferred Qualifications: Proven capability in mechanics and mathematics. Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.). Proficiency with numerical

Read the full description at jobs.apple.com. FewerJobs shows a preview and links to the original posting.