IC Packaging Integration Engineer

Benefits

Parental leave

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Non-birth-parent leave

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Family-building benefits

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Verification

Not verified last checked Jun 13, 2026

Salary

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401(k) match

Listed Source: EMPLR_CONTRIB_INCOME_AMT. source Last checked Jun 13, 2026.

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Schedule

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Weekend work

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Application

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Deadline

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About this role

IC Packaging Integration Engineer Austin, United States of America Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for versatile and passionate IC Packaging Engineer to join our team! • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with advanced package solutions, new material developments, and specs Work with cross-functional domains through package definition process and deliver optimized solutions to meet electrical, mechanical, thermal requirements. Test vehicle definition and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM). Well versed with DOE principles and statistical analyses to establish robust build plans for OSATs through NPI phase. Lead package failure analysis and root cause investigations across multiple domains (wafer level processes, assembly, substrate), process excursions, and drive efficient issues resolution. Apply advanced AI/ML and data analytics techniques to convert complex foundry and OSAT datasets into actionable insights that drive process optimization and yield improvement. Minimum Qualifications: BS and 10+ years of experience in relevant industry experience Preferred Qualifications: MS/PhD and 6+ years of

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