IC Packaging Engineer, Materials and Packaging Characterization
Apple - San Francisco Bay Area, United States of America
Posted Apr 30, 2026
Benefits
- Parental leave
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- Non-birth-parent leave
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- Family-building benefits
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- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
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- Relocation assistance
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- Childcare support
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- Learning budget
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- Verification
- Not verified last checked Jun 13, 2026
- Salary
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- 401(k) match
- Listed Source: EMPLR_CONTRIB_INCOME_AMT. source Last checked Jun 13, 2026.
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Schedule
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- Weekend work
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Application
- Cover letter
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- Assessment
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- Deadline
- Not stated
Where they hire
State eligibility is not yet verified.
About this role
IC Packaging Engineer, Materials and Packaging Characterization San Francisco Bay Area, United States of America Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention to detail and a passion for excellence to work towards extraordinary results? We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and help shape the next generation of category-defining Apple products. As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization methodologies, evaluate state-of-the-art packaging materials, and solve complex yield and reliability challenges to ensure our components meet Apple's uncompromising standards for performance and robustness. Package Characterization: Design and execute testing of IC packages under rigorous environmental and reliability stress conditions, including dynamic mechanical loading, thermal cycling, and moisture stressing. Material Evaluation: Lead the characterization of advanced packaging materials (e.g., solders, polymers, dielectrics) and manage material characterization activities at external suppliers. Methodology Development: Develop novel experimental methodologies, including designing custom fixtures, setting up specialized test equipment, and integrating advanced data acquisition systems. Failure Analysis: Drive root-cause analysis and troubleshooting for complex packaging-related yield and reliability issues. Minimum Qualifications: BS and a minimum of 10 years relevant industry experience or equivalent Preferred Qualifications: BS in Materials Science, Mechanical Engineering, Physics, or a related technical field, with 3+ years of relevant industry experience strongly preferred Experimental Mechanics:
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