Staff Mechanical Engineer - Electronics Packaging and Rugged Design

Benefits

Parental leave

Not verified

Non-birth-parent leave

Not verified

Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

Not verified

Relocation assistance

Not verified

Childcare support

Not verified

Learning budget

Not verified

Verification

Not verified checked Jun 13, 2026

Salary

Not verified

401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)

$116,543 U.S. median for this role

Projected growth (BLS Employment Projections)

+9.8% - Much faster than average

Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

Engineering From the posting source checked Jun 20, 2026

Seniority

Staff Plus From the posting source checked Jun 20, 2026

Work mode

Remote From the posting source checked Jun 20, 2026

In-office days

0 days From the posting source checked Jun 20, 2026

Schedule

Shift type

Not verified

Weekend work

Not verified

Company

Company stage

Public-company From the posting source checked Jun 20, 2026

Equity

Offered Verified - SEC 10-K source checked Jun 20, 2026

Application

Cover letter

Not verified

Assessment

Not verified

Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

Staff Mechanical Engineer - Electronics Packaging and Rugged Design Work Location (Country) United States | Remote/Onsite Onsite Position Overview: The Principal Mechanical Engineer will play a pivotal role in the design and development of Phantom camera electronics packaging solutions with a focus on rugged design and thermal management. This role requires a deep understanding of mechanical engineering principles, materials science, and cost-effective manufacturing processes. The ideal candidate will have a proven track record in designing robust and reliable products that perform under extreme conditions while maintaining sensitivity to Cost of Goods Sold (COGS). In addition to electronics packaging, this role requires skill in tolerancing for manufacturability/serviceability, as well as broad knowledge of fabrication techniques, such as CNC, casting, extrusion, injection molding, etc. Key Responsibilities: Design and Development : Lead the design and development of high-speed Phantom camera electronics packaging solutions using SolidWorks 3D CAD software, ensuring they meet performance, reliability, and cost targets. Design scope includes chassis and heat sink components, as well as accessories, cables and support equipment. Rugged Design: Develop ruggedized designs that can withstand harsh environmental conditions, including shock, vibration, temperature extremes, and moisture. Thermal Management: Implement effective thermal management solutions to ensure optimal performance and longevity of electronic components. Requires experience in active/passive cooling solutions. Material Selection: Select a

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