Staff Mechanical Engineer - Electronics Packaging and Rugged Design

Benefits

Parental leave

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Non-birth-parent leave

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Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

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Relocation assistance

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Childcare support

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Learning budget

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Verification

Not verified last checked Jun 13, 2026

Salary

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401(k) match

Listed Source: EMPLR_CONTRIB_INCOME_AMT. source Last checked Jun 13, 2026.

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Market context

U.S. role benchmark (BLS OEWS)

$111,944 U.S. median for this role

Projected growth (BLS Employment Projections)

+13.7% - Much faster than average

Matched to SOC 15-1252 - Data and ML aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Schedule

Shift type

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Weekend work

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Application

Cover letter

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Assessment

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Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

Staff Mechanical Engineer - Electronics Packaging and Rugged Design Work Location (Country) United States | Remote/Onsite Onsite Position Overview: The Principal Mechanical Engineer will play a pivotal role in the design and development of Phantom camera electronics packaging solutions with a focus on rugged design and thermal management. This role requires a deep understanding of mechanical engineering principles, materials science, and cost-effective manufacturing processes. The ideal candidate will have a proven track record in designing robust and reliable products that perform under extreme conditions while maintaining sensitivity to Cost of Goods Sold (COGS). In addition to electronics packaging, this role requires skill in tolerancing for manufacturability/serviceability, as well as broad knowledge of fabrication techniques, such as CNC, casting, extrusion, injection molding, etc. Key Responsibilities: Design and Development : Lead the design and development of high-speed Phantom camera electronics packaging solutions using SolidWorks 3D CAD software, ensuring they meet performance, reliability, and cost targets. Design scope includes chassis and heat sink components, as well as accessories, cables and support equipment. Rugged Design: Develop ruggedized designs that can withstand harsh environmental conditions, including shock, vibration, temperature extremes, and moisture. Thermal Management: Implement effective thermal management solutions to ensure optimal performance and longevity of electronic components. Requires experience in active/passive cooling solutions. Material Selection: Select a

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