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Principal Thermal & Multiphysics Engineer

TE Connectivity - Job Country United States

Posted Jun 12, 2026

Benefits

Parental leave
Not verified
Non-birth-parent leave
Not verified
Family-building benefits
  • Fertility benefits: Not verified
  • Adoption assistance: Not verified
  • Surrogacy assistance: Not verified
Mental health support
Not verified
Relocation assistance
Not verified
Childcare support
Not verified
Learning budget
Not verified
Verification
Not verified checked Jun 13, 2026
Salary
$154K-$231K From the posting source checked Jun 20, 2026
401(k) match
Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)
$55,390 U.S. median for this role
Projected growth (BLS Employment Projections)
-0.1% - Decline

248% above the BLS role benchmark for teaching and education aggregate.

Posted salary is far from this role benchmark; treat it as low confidence.

Matched to SOC 25-2021 - Teaching and Education aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function
Teaching Education From the posting source checked Jun 20, 2026
Seniority
Principal From the posting source checked Jun 20, 2026

Schedule

Shift type
Not verified
Weekend work
Not verified

Company

Company stage
Public-company From the posting source checked Jun 20, 2026
Equity
Offered Verified - SEC 10-K source checked Jun 20, 2026

Application

Cover letter
Not verified
Assessment
Not verified
Deadline
Not stated

Where they hire

State eligibility is not yet verified.

About this role

Principal Thermal & Multiphysics Engineer Job Country United States At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Principal Thermal & Multiphysics Engineer in the Mechanical Center of Excellence team, you will lead advanced thermal research, thermal predictive analysis and validation efforts for cutting-edge interconnect systems used in AI data centers, high-performance computing, and next-generation communication infrastructure Your role involves supporting development of novel thermal structures, executing Multiphysics thermal simulations, validating materials, and collaborating cross-functionally to enhance product performance, reliability, and manufacturability. You will operate with a high degree of autonomy and technical depth to define and drive innovation across mechanical platforms-from early-stage PoCs through NPI handoff This role is highly cross-functional, requiring collaboration with structural, electrical, signal integrity, system architecture, manufacturing, and supplier development teams. BU Overview Consumer, network, and data center applications change at an exponential pace and the Data & Devices (D&D) business unit at TE Connectivity is at the heart of a continuously expanding connected life. Accordingly, we provide responsive, iterative, and fundamentally agile capabilities and conceive, design, and manufacture to support today's demands. Our customers are building the devices and the infrastruc

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