Die Bonding Specialist, Silicon Assembly (Starlink)

Benefits

Parental leave

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Non-birth-parent leave

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Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

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Relocation assistance

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Childcare support

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Learning budget

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Verification

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Salary

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401(k) match

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Market context

U.S. role benchmark (BLS OEWS)

$55,206 U.S. median for this role

Projected growth (BLS Employment Projections)

+5.5% - Faster than average

Matched to SOC 49-9071 - Trades aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

Trades From the posting source checked Jun 20, 2026

Seniority

Mid From the posting source checked Jun 20, 2026

Schedule

Shift type

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Weekend work

Required From the posting source checked Jun 20, 2026

Application

Cover letter

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Assessment

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Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

Die Bonding Specialist, Silicon Assembly (Starlink) Bastrop, TX SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. DIE BONDING SPECIALIST, SILICON ASSEMBLY (STARLINK) One of the most ambitious missions that SpaceX has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with IC packaging engineers, test engineers, equipment manufacturers, and leadership. The success of Starlink depends on the quality, reliability, cost, manufacturability, throughput, and security of the products that you deliver. If you seek a fast-paced, dynamic environment; if you thrive on solving difficult problems where resolutions have high impact; and if you love the challenge of building something from scratch, then this role will be an ideal next career step. RESPONSIBILITIES: - Operate and program die bonding equipment, including automated pick-and-place systems, epoxy dispensers, flip-chip bonders, and eutectic die attach tools, to achieve accurate die placement with micron-level precision and minimal tilt - Develop and optimize bonding recipes by adjusting parameters such as dispense volume, cure temperature, pressure, and reflow profiles to ensure void-free bonds, strong adhesion, and thermal reliability - Perform in-process

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