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Engineering Intern

Overview - Taipei | Hybrid | Remote

Posted Jun 10, 2026

Benefits

Parental leave
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Non-birth-parent leave
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Family-building benefits
  • Fertility benefits: Not verified
  • Adoption assistance: Not verified
  • Surrogacy assistance: Not verified
Mental health support
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Relocation assistance
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Childcare support
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Learning budget
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Verification
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Salary
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Market context

U.S. role benchmark (BLS OEWS)
$81,444 U.S. median for this role
Projected growth (BLS Employment Projections)
+6.9% - Faster than average

Matched to SOC 29-1141 - Healthcare aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function
Healthcare From the posting source checked Jun 20, 2026
Seniority
Entry From the posting source checked Jun 20, 2026
Work mode
Hybrid From the posting source checked Jun 20, 2026
In-office days
2 days From the posting source checked Jun 20, 2026

Schedule

Shift type
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Weekend work
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Application

Cover letter
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Assessment
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Deadline
Not stated

Where they hire

State eligibility is not yet verified.

About this role

Engineering Intern Taipei | Hybrid | Remote 職位描述 (Job Description) 我們打造應用於中國與美國各地工廠的工業級邊緣運算 AI 相機 (industrial AI cameras)。對我們而言,產品的「可靠性」就是一切--當我們的相機停機時,工廠的生產線就會被迫停擺。我們的產品研發中心位於台北,總部設於舊金山,並在中國與美國皆設有大型的應用與客戶工程團隊。 職位角色 (The Role) 我們正在招募一名 (工程實習生) 實習生 (Engineering Intern),以協助我們台北研發中心的團隊。這是一個專注於測試與驗證硬體、軟體以及 AI 整合的實作技術崗位。你將負責搭建測試台、執行自動化測試套件,並追蹤邊緣案例的錯誤 (edge-case bugs),以確保我們的邊緣相機達到零停機時間。你將直接與資深工程師協作,以精準且高效的速度維持穩定、可靠的硬體管線。 工作內容 (What You'll Do) - 硬體準備 (Hardware Prep): 拆封全新的相機硬體、檢查實體連接線路,並將其連接至測試台以進行自動化建置。 - 軟體安裝 (Software Installation): 將裝置連接至測試用電腦,並依照技術指南使用命令列工具 (command-line tools) 或自訂腳本燒錄最新的韌體 (firmware) 與嵌入式作業系統。 - 最終測試 (Final Testing): 執行自動化 QA 測試套件(使用 Python 或 C 語言),以驗證裝置穩定性、影像串流品質以及核心週邊硬體的效能。 - 資料整理 (Organization): 在 Confluence 或 Jira 等工具中記錄測試通過/失敗的結果、標記軟體錯誤 (bugs),並在驗證完成後將裝置整潔地重新打包。 - 實驗室維護 (Lab Support): 維護迴歸測試機架 (regression testing racks)、整理網路線與序列訊號線,並確保所有除錯工具皆已貼上標籤且妥善存放。 必要條件 (Must-Haves) - 教育背景 (Education): 目前就讀或已取得資訊工程 (CS)、電機/電子工程 (EE)、機器人工程或相關技術領域的學位。 - 專案經驗 (Project Background): 具備實作專案經驗(包含課堂內與課外的個人獨立專案或 side projects)。 - 核心特質 (Core Trait): 展現出聰明、樂於接受指導、具備高度適應力,且能在團隊協作環境中蓬勃發展。 - 程式技能 (Programming Skills): 熟悉至少一種程式語言(Python、C、C++ 或 JavaScript)。 加分條件 (Nice-to-Haves) - 網路基礎知識 (Networking Basics): 熟悉基本網路協定與概念(如 IP 設定、路由器或數據傳輸)。 為什麼加入我們 (Why Join) - 親手建置直接影響真實世界製造業生產線的核心自動化系統。 - 享有高度的專案所有權與自主權,並獲得資深嵌入式工程師的直接導師制 (mentorship) 指導。 - 與涵蓋硬體、AI 以及客戶工程領域的世界級團隊緊密協作。 - 加入一家快速成長、節奏高效且已實現盈利的初創企業 (startup)。

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