Technician II
General Atomics - Location not specified
Posted Jun 12, 2026
Benefits
- Parental leave
- Not verified
- Non-birth-parent leave
- Not verified
- Family-building benefits
-
- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
- Not verified
- Relocation assistance
- Not verified
- Childcare support
- Not verified
- Learning budget
- Not verified
- Verification
- Not verified checked Jun 7, 2026
- Salary
- Not verified
- 401(k) match
- Reported from DOL Form 5500 industry filing (not employer-specific)
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Market context
- U.S. role benchmark (BLS OEWS)
- $55,206 U.S. median for this role
- Projected growth (BLS Employment Projections)
- +5.5% - Faster than average
Matched to SOC 49-9071 - Trades aggregate by role bucket.
Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.
Role
Schedule
- Shift type
- Not verified
- Weekend work
- Not verified
Application
- Cover letter
- Not verified
- Assessment
- Not verified
- Deadline
- Not stated
Where they hire
State eligibility is not yet verified.
About this role
Technician II GA's Electromagnetic Systems (EMS) Group focuses on the military and commercial applications of advanced electromagnetic technologies, including power generation and distribution, magnetic levitation, laser and weapons systems, and systems design and engineering. The EMS Group supports government customers, which include the Department of Defense, Department of Energy, the Department of Transportation as well as a range of commercial customers. We have an exciting opportunity for a Full Time Technician in the Printed Circuit Board Assembly Department in our Tupelo, MS location supporting our Electromagnetic Systems Group! The ideal candidate would assist with modification, fabrication, assembly, operations, installation, repair and maintenance of general laboratory, experimental and commercial equipment; assists in set up and may conduct routine experiments and tests; records data. DUTIES AND RESPONSIBILITIES: Under close supervision with detailed instructions and frequent review: - Installs, repairs and replaces through-hole and surface mount technology (SMT) packages including QFP (Quad Flat Package), BGA (Ball Grid Array), chip components, SOIC (small-outline integrated circuit), axial and radial components. - Performs solder operations according to J-STD-001 and IPC-610 specifications. - Maintain and operate various Printed Circuit Board Assembly Equipment including Surface Mount lines, Robotic Soldering, X-Ray, Automated Optical Inspection, and Conformal Coating Applications - Performs functional testing and troubleshooting of equipment and systems in assigned area by utilizing standard engineering and scientific principles. - Utilize test equipment such as Oscilloscopes, Function Generators, etc. - Responsible for observing all laws, regulations, and other applicable obligations wherever and whenever business is conducted on behalf of the
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