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Technician II

General Atomics - Location not specified

Posted Jun 12, 2026

Benefits

Parental leave
Not verified
Non-birth-parent leave
Not verified
Family-building benefits
  • Fertility benefits: Not verified
  • Adoption assistance: Not verified
  • Surrogacy assistance: Not verified
Mental health support
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Relocation assistance
Not verified
Childcare support
Not verified
Learning budget
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Verification
Not verified checked Jun 7, 2026
Salary
Not verified
401(k) match
Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)
$55,206 U.S. median for this role
Projected growth (BLS Employment Projections)
+5.5% - Faster than average

Matched to SOC 49-9071 - Trades aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function
Trades From the posting source checked Jun 20, 2026
Seniority
Mid From the posting source checked Jun 20, 2026

Schedule

Shift type
Not verified
Weekend work
Not verified

Application

Cover letter
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Assessment
Not verified
Deadline
Not stated

Where they hire

State eligibility is not yet verified.

About this role

Technician II GA's Electromagnetic Systems (EMS) Group focuses on the military and commercial applications of advanced electromagnetic technologies, including power generation and distribution, magnetic levitation, laser and weapons systems, and systems design and engineering. The EMS Group supports government customers, which include the Department of Defense, Department of Energy, the Department of Transportation as well as a range of commercial customers. We have an exciting opportunity for a Full Time Technician in the Printed Circuit Board Assembly Department in our Tupelo, MS location supporting our Electromagnetic Systems Group! The ideal candidate would assist with modification, fabrication, assembly, operations, installation, repair and maintenance of general laboratory, experimental and commercial equipment; assists in set up and may conduct routine experiments and tests; records data. DUTIES AND RESPONSIBILITIES: Under close supervision with detailed instructions and frequent review: - Installs, repairs and replaces through-hole and surface mount technology (SMT) packages including QFP (Quad Flat Package), BGA (Ball Grid Array), chip components, SOIC (small-outline integrated circuit), axial and radial components. - Performs solder operations according to J-STD-001 and IPC-610 specifications. - Maintain and operate various Printed Circuit Board Assembly Equipment including Surface Mount lines, Robotic Soldering, X-Ray, Automated Optical Inspection, and Conformal Coating Applications - Performs functional testing and troubleshooting of equipment and systems in assigned area by utilizing standard engineering and scientific principles. - Utilize test equipment such as Oscilloscopes, Function Generators, etc. - Responsible for observing all laws, regulations, and other applicable obligations wherever and whenever business is conducted on behalf of the

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