Signal Integrity Engineer, Sr Staff
d-Matrix - Santa Clara, Santa Clara, Ca, Ca, United States
Posted May 6, 2026
Benefits
- Parental leave
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- Non-birth-parent leave
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- Family-building benefits
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- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
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- Relocation assistance
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- Childcare support
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- Learning budget
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- 401(k) match
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Schedule
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- Weekend work
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Application
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Where they hire
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About this role
Signal Integrity Engineer, Sr Staff Santa Clara, Santa Clara, Ca, Ca, United States At d-Matrix , we are focused on unleashing the potential of generative AI to power the transformation of technology. We are at the forefront of software and hardware innovation, pushing the boundaries of what is possible. Our culture is one of respect and collaboration. We value humility and believe in direct communication. Our team is inclusive , and our differing perspectives allow for better solutions. We are seeking individuals passionate about tackling challenges and are driven by execution. Ready to come find your playground? Together , we can help shape the endless possibilities of AI. About the Role As the Senior Staff SI/PI Engineer, you will be the technical authority responsible for the electrical integrity of d-Matrix's high-performance AI compute platforms. In an environment where we are pushing 112G/224G SerDes and delivering thousands of Amps to multi-chip modules (MCM), your role is critical to ensuring that our "Digital In-Memory Computing" architecture translates into stable, manufacturable, and world-class hardware. You will lead the end-to-end modeling, simulation, and correlation efforts-from the silicon die through the package and across the system PCBA. Key Responsibilities • End-to-End SI/PI Ownership: Drive the SI/PI strategy for next-generation AI accelerators, focusing on high-speed interfaces (PCIe Gen6/7, CXL, LPDDR5) and custom Chiplet-to-Chiplet interconnects. • MCM & Package Simulation: Lead the modeling and analysis of complex multi-chip packages, including interposer routing, micro-bump parasitic extraction, and die-to-die (D2D) link budgeting. • Advanced PDN Architecting: Design and optimize
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