Silicon Photonics & Optical Packaging Eng
Apple - San Francisco Bay Area, United States of America
Posted Oct 28, 2025
Benefits
- Parental leave
- Not verified
- Non-birth-parent leave
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- Family-building benefits
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- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
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- Relocation assistance
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- Childcare support
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- Learning budget
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- Verification
- Not verified last checked Jun 13, 2026
- Salary
- Not verified not verified - source not recorded; timestamp not recorded
- 401(k) match
- Listed Source: EMPLR_CONTRIB_INCOME_AMT. source Last checked Jun 13, 2026.
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Schedule
- Shift type
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- Weekend work
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Application
- Cover letter
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- Assessment
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- Deadline
- Not stated
Where they hire
State eligibility is not yet verified.
About this role
Silicon Photonics & Optical Packaging Eng San Francisco Bay Area, United States of America Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to realize high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost. Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel. Design and model silicon photonic devices and optical interconnects, optimizing coupling, thermal, and signal integrity performance. Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using tools like Lumerical, Zemax, or COMSOL. Prototype and characterize integrated photonic packages, correlating simulation with optical and electrical measurements. Collaborate with cross-functional teams (process,
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