FewerJobs.
All jobs

Silicon Photonics & Optical Packaging Eng

Apple - San Francisco Bay Area, United States of America

Posted Oct 28, 2025

Benefits

Parental leave
Not verified
Non-birth-parent leave
Not verified
Family-building benefits
  • Fertility benefits: Not verified
  • Adoption assistance: Not verified
  • Surrogacy assistance: Not verified
Mental health support
Not verified
Relocation assistance
Not verified
Childcare support
Not verified
Learning budget
Not verified
Verification
Not verified last checked Jun 13, 2026
Salary
Not verified not verified - source not recorded; timestamp not recorded
401(k) match
Listed Source: EMPLR_CONTRIB_INCOME_AMT. source Last checked Jun 13, 2026.

Was this benefit information wrong? Tell us.

Schedule

Shift type
Not verified
Weekend work
Not verified

Application

Cover letter
Not verified
Assessment
Not verified
Deadline
Not stated

Where they hire

State eligibility is not yet verified.

About this role

Silicon Photonics & Optical Packaging Eng San Francisco Bay Area, United States of America Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to realize high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost. Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel. Design and model silicon photonic devices and optical interconnects, optimizing coupling, thermal, and signal integrity performance. Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using tools like Lumerical, Zemax, or COMSOL. Prototype and characterize integrated photonic packages, correlating simulation with optical and electrical measurements. Collaborate with cross-functional teams (process,

Read the full description at jobs.apple.com. FewerJobs shows a source-linked preview and links to the original posting.

Apply at jobs.apple.com

Apply link not verified; last-live date unavailable.

What verified means

Verified means a displayed claim has a recorded source field, a source URL when available, and a timestamp showing when FewerJobs checked or enriched the evidence.

Related jobs