Signal/Power Integrity Eng, Annapurna Labs
Amazon - Austin, Texas, USA
Posted Apr 9, 2026
Benefits
- Parental leave
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- Non-birth-parent leave
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- Family-building benefits
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- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
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- Relocation assistance
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- Childcare support
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- Learning budget
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- Verification
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- Salary
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- 401(k) match
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Schedule
- Shift type
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- Weekend work
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Application
- Cover letter
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- Assessment
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- Deadline
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Where they hire
State eligibility is not yet verified.
About this role
Signal/Power Integrity Eng, Annapurna Labs Austin, Texas, USA Annapurna Labs designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago-even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world. We are seeking a SI/PI Engineer (Signal Integrity and Power Integrity) who will play a key role in the definition, design and validation of AWS next generation machine learning ASICs. As a member of our hardware team, you will have a meaningful opportunity to participate in the design and execution of all SI related topics, with the goal of creating and customized platforms that fit within AWS datacenter's world leading technology. Key job responsibilities Our engineers collaborate across diverse teams, projects, and environments to have a firsthand impact on our global customer base. You'll bring a passion for innovation, data, and hardware knowledge. You'll also solve challenging technical problems, often ones not solved before, at every layer of the design. This Signal Integrity Engineering role combines technical expertise with strategic design leadership. The ideal candidate will bring 3+ years of experience in signal and power integrity, with hands-on expertise in simulation tools like Hspice, Cadence, and HFSS. The role involves working with advanced packaging technologies, PCB design, and power delivery systems. Additional experience with die capacitors, SOC power, and 3D/2.5D EMIR simulation tools would be
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