Plasma Process & Equipment Engineer (m/f/d)
TE Connectivity - Job Country Germany
Posted Jun 12, 2026
Benefits
- Parental leave
- Not verified
- Non-birth-parent leave
- Not verified
- Family-building benefits
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- Fertility benefits: Not verified
- Adoption assistance: Not verified
- Surrogacy assistance: Not verified
- Mental health support
- Not verified
- Relocation assistance
- Not verified
- Childcare support
- Not verified
- Learning budget
- Not verified
- Verification
- Not verified checked Jun 13, 2026
- Salary
- Not verified
- 401(k) match
- Reported from DOL Form 5500 industry filing (not employer-specific)
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Market context
- U.S. role benchmark (BLS OEWS)
- $116,543 U.S. median for this role
- Projected growth (BLS Employment Projections)
- +9.8% - Much faster than average
Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.
Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.
Role
Schedule
- Shift type
- Not verified
- Weekend work
- Not verified
Company
Application
- Cover letter
- Not verified
- Assessment
- Not verified
- Deadline
- Not stated
Where they hire
State eligibility is not yet verified.
About this role
Plasma Process & Equipment Engineer (m/f/d) Job Country Germany At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview We are looking for a highly motivated Process & Equipment Engineer (m/f/d) specializing in Plasma Processing to support and optimize semiconductor manufacturing operations. This role focuses on plasma-based deposition, etch, and ashing technologies, including PECVD, RIE, IBE, and Etch systems . You will be responsible for process development, tool qualification, and continuous improvement of plasma processes to ensure stable manufacturing performance, high yield, and cost-effective production. You will collaborate closely with cross-functional teams (R&D, maintenance, production, quality teams) and external equipment suppliers to maintain process stability, implement new technologies, and drive operational excellence in a high-volume fab environment. Job Requirements Process Development & Optimization: Develop, characterize, and optimize plasma-based semiconductor processes such as PECVD deposition, reactive ion etching (RIE), ion beam etching (IBE), and plasma ashing systems Define and refine process windows and plasma parameters (RF power, pressure, gas chemistry, bias voltage, temperature) using Design of Experiments (DOE) and statistical analysis Investigate yield excursions, plasma-induced defects, and process deviations through systematic root cause analysis. Establish and maintain process control strate
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