Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

Verified benefits

Parental leave

12 weeks source

Non-birth-parent leave

12 weeks

Verified

Yes last checked unknown

Salary

Not disclosed

Where they hire

State eligibility is not yet verified.

About this role

Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding) Malaysia, Kulim Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding) /job/Malaysia-Kulim/Process-and-Equipment-Module-Engineer--DIE-Attach-or-Thermal-Compress-Bonding-_JR0279601 Malaysia, Kulim Posted Today

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