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Thermo-Mech CFD Simulation Intern

Etched - San Jose, CA, United States

Posted Apr 24, 2026

Benefits

Parental leave
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Non-birth-parent leave
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Family-building benefits
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  • Adoption assistance: Not verified
  • Surrogacy assistance: Not verified
Mental health support
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Relocation assistance
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Childcare support
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Learning budget
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401(k) match
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Market context

U.S. role benchmark (BLS OEWS)
$116,543 U.S. median for this role
Projected growth (BLS Employment Projections)
+9.8% - Much faster than average

Matched to SOC 15-1252 - Software Engineering aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function
Engineering From the posting source checked Jun 20, 2026
Seniority
Entry From the posting source checked Jun 20, 2026

Schedule

Shift type
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Weekend work
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Application

Cover letter
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Assessment
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Deadline
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Where they hire

State eligibility is not yet verified.

About this role

Thermo-Mech CFD Simulation Intern San Jose, CA, United States About Etched Etched is building the world's first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history. Job Summary We are seeking a talented Thermo-Mechanical, CFD Simulation Engineering Intern focused on Chip-on-Wafer-on-Substrate (CoWoS) package development to join our Advanced IC Packaging Team in Fall '26, Spring '27, or Summer '27 . You'll use tools like ANSYS Mechanical APDL and ANSYS FLUENT to perform critical thermo-mechanical/CFD analysis and contribute to next-generation high-performance computing systems. Key responsibilities - Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL - Perform thermo-mechanical stress/strain analysis and thermal cycling simulations - Analyze package warpage, solder joint reliability, and interconnect stress - Develop CFD models using ANSYS FLUENT for solder reflow modeling - Collaborate with design engineering teams on package development You may be a good fit if you have - Education & Experience - Pursuing a degree in Mechanical Engineering or related field - Academic or project experience with FEA/CFD tools and analysis - Technical Skills - Proficiency in SOLIDWORKS/NX, ANSYS Mechanical APDL and ANSYS FLUENT - Understanding of semiconductor packaging

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