Principal, Design Engineering (Thermal)

Benefits

Parental leave

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Non-birth-parent leave

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Family-building benefits

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• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

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Relocation assistance

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Childcare support

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Learning budget

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Verification

Not verified checked Jun 7, 2026

Salary

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401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)

$111,944 U.S. median for this role

Projected growth (BLS Employment Projections)

+13.7% - Much faster than average

Matched to SOC 15-1252 - Data and ML aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Role

Role function

Data From the posting source

Seniority

Staff Plus From the posting source

Schedule

Shift type

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Weekend work

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Company

Equity

Offered Verified - SEC 10-K source

Application

Cover letter

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Assessment

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Deadline

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Where they hire

State eligibility is not yet verified.

About this role

Principal, Design Engineering (Thermal) City Austin | State/Province Texas | Country USA Req ID: 133783 Region: Country USA State/Province: State/Province Texas City Austin Summary Join a world class team to create high end electronics cooling solutions for systems such as AI servers, switches, and accelerators. We work hard together to design at the leading edge of cooling technology. Must have at minimum 15+ years of experience in data center liquid cooling for high-power graphics processing units (GPUs). Strong engineering fundamentals are essential. As a member of the Hardware Product Development team, you have the ability to work in partnership with hardware, software, and thermal architects within and outside Celestica to define the best in class products. Detailed Description Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing. Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs. Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products. Conceive and implement ways to enhance and extend operation of heat transfer hardware. Consider the thermal aspects of chip packaging technologies. Apply best-in-class fluid flow geometry and technology to cool high heat flux chips. Determine and consider the effects of contact resistance and the use

Read the full description at careers.celestica.com. FewerJobs shows a preview and links to the original posting.