Senior Staff Thermal Design Engineer

Benefits

Parental leave

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Non-birth-parent leave

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Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

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Relocation assistance

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Childcare support

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Learning budget

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Verification

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Salary

$176K-$224K not verified - source not recorded; timestamp not recorded

401(k) match

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Market context

U.S. role benchmark (BLS OEWS)

$111,944 U.S. median for this role

Projected growth (BLS Employment Projections)

+13.7% - Much faster than average

79% above the BLS role benchmark for data and ml aggregate.

Matched to SOC 15-1252 - Data and ML aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Schedule

Shift type

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Weekend work

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Application

Cover letter

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Assessment

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Deadline

Not stated

Where they hire

State eligibility is not yet verified.

About this role

Senior Staff Thermal Design Engineer City Austin | State/Province Texas | Country USA Req ID: 133513 Region: Country USA State/Province: State/Province Texas City Austin Summary Join a world class team to create high end electronics cooling solutions for systems such as AI servers, switches, and accelerators. We work hard together to design at the leading edge of cooling technology. Must have relevant coursework in heat transfer and fluid mechanics, and good familiarity with 3D software applications. As a member of the Hardware Product Development team, you have the ability to work in partnership with hardware, software, and thermal architects within and outside Celestica to define the best in class products. Celestica has a profoundly cooperative and nonconfrontational culture. Detailed Description Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing. Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs. Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products. Conceive and implement ways to enhance and extend operation of heat transfer hardware. Consider the thermal aspects of chip packaging technologies. Apply best-in-class fluid flow geometry and technology to cool high heat flux chips. Determine and consider the effects of contact re

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