DFM R&D Engineer — Advanced Simulation & Materials

Benefits

Parental leave

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Non-birth-parent leave

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Family-building benefits

• Fertility benefits: Not verified
• Adoption assistance: Not verified
• Surrogacy assistance: Not verified

Mental health support

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Relocation assistance

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Childcare support

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Learning budget

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Verification

Not verified checked Jun 13, 2026

Salary

$172K-$306K not verified - source not recorded; timestamp not recorded

401(k) match

Reported from DOL Form 5500 industry filing (not employer-specific)

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Market context

U.S. role benchmark (BLS OEWS)

$111,944 U.S. median for this role

Projected growth (BLS Employment Projections)

+13.7% - Much faster than average

113% above the BLS role benchmark for data and ml aggregate.

Matched to SOC 15-1252 - Data and ML aggregate by role bucket.

Source: U.S. Bureau of Labor Statistics, OEWS, May 2024 and Employment Projections, 2024-2034.

Schedule

Shift type

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Weekend work

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Application

Cover letter

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Assessment

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Deadline

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Where they hire

State eligibility is not yet verified.

About this role

DFM R&D Engineer — Advanced Simulation & Materials Cupertino, United States of America At Apple, innovative ideas become extraordinary products through deep engineering rigor and strong cross-functional collaboration. The DFM R&D Lab plays a critical role in developing the materials, processes, and predictive modeling frameworks that enable advanced semiconductor packaging and microelectronics technologies to scale reliably to high-volume manufacturing. We are seeking an R&D Engineer who is excited to solve complex mechanical challenges, connect simulation with real-world data, and influence product decisions through thoughtful, physics-based analysis. This position blends finite element simulation with hands-on materials characterization. You will work on semiconductor packages, PCB systems, and SMT assemblies - developing predictive models that inform design direction, reliability strategy, and manufacturing readiness. You'll partner closely with design, reliability, and manufacturing teams to define key load cases, build and validate material models, and reduce risk early in development. Your work will help close the gap between simulation and hardware through disciplined experimentation and correlation. Develop and execute finite element models (implicit and explicit) for semiconductor packaging, PCB structures, and SMT assemblies Analyze thermo-mechanical behavior including warpage, stress evolution, drop/shock, fatigue, and fracture Lead or support material characterization efforts (mechanical, physical, chemical) for microelectronics materials Build, calibrate, and validate material models using experimental data Design and execute DOEs to correlate simulation with test results and support reliability projections Drive early design optimization and support root cause investigations of mechanical failures Integrate module-level simulations into larger product assembly models Communicate analysis results clearly to cross-functional

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