SEED Engineer Program - Software Development Engineer Intern, 2026 Shenzhen
Amazon - Shenzhen, CHN
Posted 3/26/2026
Verified benefits
- Parental leave
- 6 weeks source
- Non-birth-parent leave
- 6 weeks
- Verified
- Yes last checked 2023
- Salary
- Not disclosed
Where they hire
State eligibility is not yet verified.
About this role
SEED Engineer Program - Software Development Engineer Intern, 2026 Shenzhen Shenzhen, CHN · 毕业时间:2027年10月 - 2028年7月之间毕业的应届毕业生 · 实习入职日期:2026年6月 · 实习时间:保证一周实习5天全职实习,至少持续3个月 · 工作地点:深圳 · 投递须知: 1 填写简历申请时,请把必填和非必填项都填写完整。提交简历之后就无法修改了哦! 2 学校的英文全称请准确填写。中英文对应表请查这里(无法浏览请登录后浏览)https://docs.qq.com/sheet/DVmdaa1BCV0RBbnlR?tab=BB08J2 Seed Engineer
Read the full description at www.amazon.jobs. FewerJobs shows a short excerpt and links to the source.
Related jobs
-
BI Lead Developer
Ametek - Location not specified
-
Electrical Systems Engineer
Ametek - Location not specified
-
Software Engineer, AVP - Credit and Insurance Technology
Blackstone Inc. - New York
-
Manager, Software Engineering - AI and Data Platform
Blackbaud INC - Remote - Anywhere - USA