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"k401_contribution_source_url": null, "k401_contribution_source_fields": [], "profit_sharing": false, "bonus_offered": false, "mental_health_support": null, "childcare_subsidy": null, "fertility_family_building_benefits": null, "adoption_assistance_offered": null, "surrogacy_assistance_offered": null, "student_loan_repayment_offered": null, "learning_budget_offered": null, "relocation_assistance": null, "top_startup_sources": [], "posted_at": "2026-06-12T17:37:43.000Z", "apply_url": "https://jobs.smartrecruiters.com/RenesasElectronics/744000113141168--", "apply_url_verified": false, "ats": "smartrecruiters", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "半導体組立工程 技術開発エンジニア Yonezawa, , Japan Company Description: Job Description: 【募集背景】 当社では、次世代パッケージ技術（Flip Chip、SiP など）の開発を中心に、半導体後工程における技術革新を積極的に推進しています。 特に AI・高性能コンピューティング（HPC）、車載、IoT 分野においては、より高密度・高信頼性・高放熱性を備えたパッケージ技術が求められており、FCCSP（Flip Chip Chip Scale Package）や FCBGA といった先端技術の開発が加速しています。 今後、デバイスの複雑化や多機能化がさらに進む中、技術領域の拡大と開発体制の強化が不可欠となっています。 こうした背景から、当社では半導体後工程に関する技術経験をお持ちのエンジニアを新たに募集いたします。 本ポジションでは、AI/HPC向けの高密度・高放熱パッケージ、車載・IoT向けの高信頼性パッケージなど、業界最前線の技術開発に携わることができます。 AIや自動運転など、社会を大きく変革する技術を根幹から支えるパッケージ開発に貢献できる、非常にやりがいのある環境です。 【主な業務内容】 半導体後工程（アセンブリ・パッケージング・テスト）における技術開発業務を担当いただきます。 ・FCLGA、FCCSP、BGAなどの先端パッケージ技術の開発・評価 ・組立工程（ソルダーペースト印刷、部品実装、FC Bond、リフロー工程、フラックス洗浄工程）のプロセス開発、改善 ・製造ラインの立ち上げ・量産移行支援 ・工程の品質・歩留まり改善活動 ※就業場所の変更の範囲、従事すべき業務の変更の範囲については、選考時に詳細をお伝えいたします。 Qualifications: 【MUST】 ・半導体後工程（組立・パッケージング）の技術開発経験（4年以上） ・SMT工程の技術開発経験者（4年以上） ・工程改善・品質管理・設備導入などの実務経験 ・技術系学位（機械、材料、電子、化学など） 【WANT】 ・FCPackageや高密度パッケージ向けプロセス開発・評価経験 ・AI/HPC向けパッケージの開発経験（高信頼性設計） ・車載・IoT向けパッケージの信頼性試験・規格対応経験 ・ISO/IATFなど品質規格への対応経験 Additional Information: ルネサスは、「 To Make Our Lives Easier 」（人々の暮らしを楽“ラク”にする）というPurposeの下、組み込み半導体ソリューションを提供します。高品質とシステムレベルノウハウを兼ね備えた組み込み半導体のリーダーとして、自動車、産業、インフラ・IoT分野向けに、ハイパフォーマンスコンピューティング、組み込みプロセッシング、アナログ＆コネクティビティ、そしてパワーを含めた幅広い製品ポートフォリオを軸とした、スケーラブルで包括的なソリューションを提供しています。 ルネサスは、30か国以上で22,000 人を超える多様性あふれる従業員と共に、限界に挑戦しながら、デジタライゼーションを通じてユーザエクスペリエンスを充実化させ、新たなイノベーションの時代を切り開いていきます。そして世界中の人々やコミュニティの未来のために、持続可能で省エネ効果の高いソリューションの開発に全力で取り組み、「 To Make Our Lives Easier 」を実現します。 ルネサスで実現できること キャリアをスタート、そしてキャリアアップ： 4つのプロダクトグループをはじめ、さまざまな部門において技術職として、また幅広いビジネスの経験を積むことができます。ハードウェア、ソフトウェアの専門知識を深めたり、新しいことにチャレンジしたりする機会があります。 やりがいとインパクトのある仕事をする： 革新的な製品とソリューションの開発に関わることにより、世界中のお客様のニーズに応えると同時に、人々の生活をより便利で安全かつ安心なものにすることに貢献できます。 「ウェルビーイング」に焦点を置いた環境で最大限に能力を発揮する： ルネサスでは、リモートワーク制度などによる柔軟な勤務体制づくり、また従業員リソースグループの積極的な活動をサポートするなど、インクルーシブな職場環境構築を目指しています。従業員を第一に考えたカルチャーとグローバルなサポート体制が、入社後すぐに活躍できる環境を提供します。 自分の力で成功を掴み、キャリアを築く準備はできていますか？ ルネサスで一緒に 未来を形づくっていきましょう 。 当社では、ハイブリッド勤務モデルを採用しており、従業員は週に2日間リモートワークを行うことができます。同時に、残りの日はチームとしてオフィスに集まり、協働を強化しています。出社指定日は火曜日から木曜日で、イノベーション、コラボレーション、そして継続的な学習に取り組む日としています。", "parental_leave_weeks": null, "non_birth_parent_leave_weeks": null, "parental_leave_weeks_source": null, "non_birth_parent_leave_weeks_source": null, "parental_leave_source_url": null, "pto_days": null, 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"cover_letter_required_source": null, "assessment_required": null, "assessment_required_source": null, "application_deadline": null, "application_deadline_source": null, "visa_sponsorship": false, "us_citizenship_required": false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null, "explanations": [ { "schema_version": "inv382.match_signal.v1", "signal_id": "sig.query.description_excerpt.88fee0c84b14c26b93", "query_id": "gq_156c4a1ac40416cad8ae", "job_id": "0913cdd16c3bae251ac76647087a3daa", "signal_type": "query_match", "display_text": "Description: \"flip\"", "tooltip": "Description matched \"flip\" from your search.", "source_binding": "bm25_field_evidence", "source_field": "description_excerpt", "source_value": "半導体組立工程 技術開発エンジニア Yonezawa, , Japan Company Description: Job Description: 【募集背景】 当社では、次世代パッケージ技術（Flip Chip、SiP など）の開発を中心に、半導体後工程における技術革新を積極的に推進しています。 特に AI・高性能コンピューティング（HPC）、車載、IoT 分野においては、より高密度・高信頼性・高放熱性を備えたパッケージ技術が求められており、FCCSP（Flip Chip Chip Scale Package）や FCBGA といった先端技術の開発が加速しています。 今後、デバイスの複雑化や多機能化がさらに進む中、技術領域の拡大と開発体制の強化が不可欠となっています。 こうした背景から、当社では半導体後工程に関する技術経験をお持ちのエンジニアを新たに募集いたします。 本ポジションでは、AI/HPC向けの高密度・高放熱パッケージ、車載・IoT向けの高信頼性パッケージなど、業界最前線の技術開発に携わることができます。 AIや自動運転など、社会を大きく変革する技術を根幹から支えるパッケージ開発に貢献できる、非常にやりがいのある環境です。 【主な業務内容】 半導体後工程（アセンブリ・パッケージング・テスト）における技術開発業務を担当いただきます。 ・FCLGA、FCCSP、BGAなどの先端パッケージ技術の開発・評価 ・組立工程（ソルダーペースト印刷、部品実装、FC Bond、リフロー工程、フラックス洗浄工程）のプロセス開発、改善 ・製造ラインの立ち上げ・量産移行支援 ・工程の品質・歩留まり改善活動 ※就業場所の変更の範囲、従事すべき業務の変更の範囲については、選考時に詳細をお伝えいたします。 Qualifications: 【MUST】 ・半導体後工程（組立・パッケージング）の技術開発経験（4年以上） ・SMT工程の技術開発経験者（4年以上） ・工程改善・品質管理・設備導入などの実務経験 ・技術系学位（機械、材料、電子、化学など） 【WANT】 ・FCPackageや高密度パッケージ向けプロセス開発・評価経験 ・AI/HPC向けパッケージの開発経験（高信頼性設計） ・車載・IoT向けパッケージの信頼性試験・規格対応経験 ・ISO/IATFなど品質規格への対応経験 Additional Information: ルネサスは、「 To Make Our Lives Easier 」（人々の暮らしを楽“ラク”にする）というPurposeの下、組み込み半導体ソリューションを提供します。高品質とシステムレベルノウハウを兼ね備えた組み込み半導体のリーダーとして、自動車、産業、インフラ・IoT分野向けに、ハイパフォーマンスコンピューティング、組み込みプロセッシング、アナログ＆コネクティビティ、そしてパワーを含めた幅広い製品ポートフォリオを軸とした、スケーラブルで包括的なソリューションを提供しています。 ルネサスは、30か国以上で22,000 人を超える多様性あふれる従業員と共に、限界に挑戦しながら、デジタライゼーションを通じてユーザエクスペリエンスを充実化させ、新たなイノベーションの時代を切り開いていきます。そして世界中の人々やコミュニティの未来のために、持続可能で省エネ効果の高いソリューションの開発に全力で取り組み、「 To Make Our Lives Easier 」を実現します。 ルネサスで実現できること キャリアをスタート、そしてキャリアアップ： 4つのプロダクトグループをはじめ、さまざまな部門において技術職として、また幅広いビジネスの経験を積むことができます。ハードウェア、ソフトウェアの専門知識を深めたり、新しいことにチャレンジしたりする機会があります。 やりがいとインパクトのある仕事をする： 革新的な製品とソリューションの開発に関わることにより、世界中のお客様のニーズに応えると同時に、人々の生活をより便利で安全かつ安心なものにすることに貢献できます。 「ウェルビーイング」に焦点を置いた環境で最大限に能力を発揮する： ルネサスでは、リモートワーク制度などによる柔軟な勤務体制づくり、また従業員リソースグループの積極的な活動をサポートするなど、インクルーシブな職場環境構築を目指しています。従業員を第一に考えたカルチャーとグローバルなサポート体制が、入社後すぐに活躍できる環境を提供します。 自分の力で成功を掴み、キャリアを築く準備はできていますか？ ルネサスで一緒に 未来を形づくっていきましょう 。 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"reranker_semantic_evidence", "source_field": "description_excerpt", "source_value": "半導体組立工程 技術開発エンジニア Yonezawa, , Japan Company Description: Job Description: 【募集背景】 当社では、次世代パッケージ技術（Flip Chip、SiP など）の開発を中心に、半導体後工程における技術革新を積極的に推進しています。 特に AI・高性能コンピューティング（HPC）、車載、IoT 分野においては、より高密度・高信頼性・高放熱性を備えたパッケージ技術が求められており、FCCSP（Flip Chip Chip Scale Package）や FCBGA といった先端技術の開発が加速しています。 今後、デバイスの複雑化や多機能化がさらに進む中、技術領域の拡大と開発体制の強化が不可欠となっています。 こうした背景から、当社では半導体後工程に関する技術経験をお持ちのエンジニアを新たに募集いたします。 本ポジションでは、AI/HPC向けの高密度・高放熱パッケージ、車載・IoT向けの高信頼性パッケージなど、業界最前線の技術開発に携わることができます。 AIや自動運転など、社会を大きく変革する技術を根幹から支えるパッケージ開発に貢献できる、非常にやりがいのある環境です。 【主な業務内容】 半導体後工程（アセンブリ・パッケージング・テスト）における技術開発業務を担当いただきます。 ・FCLGA、FCCSP、BGAなどの先端パッケージ技術の開発・評価 ・組立工程（ソルダーペースト印刷、部品実装、FC Bond、リフロー工程、フラックス洗浄工程）のプロセス開発、改善 ・製造ラインの立ち上げ・量産移行支援 ・工程の品質・歩留まり改善活動 ※就業場所の変更の範囲、従事すべき業務の変更の範囲については、選考時に詳細をお伝えいたします。 Qualifications: 【MUST】 ・半導体後工程（組立・パッケージング）の技術開発経験（4年以上） ・SMT工程の技術開発経験者（4年以上） ・工程改善・品質管理・設備導入などの実務経験 ・技術系学位（機械、材料、電子、化学など） 【WANT】 ・FCPackageや高密度パッケージ向けプロセス開発・評価経験 ・AI/HPC向けパッケージの開発経験（高信頼性設計） ・車載・IoT向けパッケージの信頼性試験・規格対応経験 ・ISO/IATFなど品質規格への対応経験 Additional Information: ルネサスは、「 To Make Our Lives Easier 」（人々の暮らしを楽“ラク”にする）というPurposeの下、組み込み半導体ソリューションを提供します。高品質とシステムレベルノウハウを兼ね備えた組み込み半導体のリーダーとして、自動車、産業、インフラ・IoT分野向けに、ハイパフォーマンスコンピューティング、組み込みプロセッシング、アナログ＆コネクティビティ、そしてパワーを含めた幅広い製品ポートフォリオを軸とした、スケーラブルで包括的なソリューションを提供しています。 ルネサスは、30か国以上で22,000 人を超える多様性あふれる従業員と共に、限界に挑戦しながら、デジタライゼーションを通じてユーザエクスペリエンスを充実化させ、新たなイノベーションの時代を切り開いていきます。そして世界中の人々やコミュニティの未来のために、持続可能で省エネ効果の高いソリューションの開発に全力で取り組み、「 To Make Our Lives Easier 」を実現します。 ルネサスで実現できること キャリアをスタート、そしてキャリアアップ： 4つのプロダクトグループをはじめ、さまざまな部門において技術職として、また幅広いビジネスの経験を積むことができます。ハードウェア、ソフトウェアの専門知識を深めたり、新しいことにチャレンジしたりする機会があります。 やりがいとインパクトのある仕事をする： 革新的な製品とソリューションの開発に関わることにより、世界中のお客様のニーズに応えると同時に、人々の生活をより便利で安全かつ安心なものにすることに貢献できます。 「ウェルビーイング」に焦点を置いた環境で最大限に能力を発揮する： ルネサスでは、リモートワーク制度などによる柔軟な勤務体制づくり、また従業員リソースグループの積極的な活動をサポートするなど、インクルーシブな職場環境構築を目指しています。従業員を第一に考えたカルチャーとグローバルなサポート体制が、入社後すぐに活躍できる環境を提供します。 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"source_field": "description_excerpt", "source_value": "半導体組立工程 技術開発エンジニア Yonezawa, , Japan Company Description: Job Description: 【募集背景】 当社では、次世代パッケージ技術（Flip Chip、SiP など）の開発を中心に、半導体後工程における技術革新を積極的に推進しています。 特に AI・高性能コンピューティング（HPC）、車載、IoT 分野においては、より高密度・高信頼性・高放熱性を備えたパッケージ技術が求められており、FCCSP（Flip Chip Chip Scale Package）や FCBGA といった先端技術の開発が加速しています。 今後、デバイスの複雑化や多機能化がさらに進む中、技術領域の拡大と開発体制の強化が不可欠となっています。 こうした背景から、当社では半導体後工程に関する技術経験をお持ちのエンジニアを新たに募集いたします。 本ポジションでは、AI/HPC向けの高密度・高放熱パッケージ、車載・IoT向けの高信頼性パッケージなど、業界最前線の技術開発に携わることができます。 AIや自動運転など、社会を大きく変革する技術を根幹から支えるパッケージ開発に貢献できる、非常にやりがいのある環境です。 【主な業務内容】 半導体後工程（アセンブリ・パッケージング・テスト）における技術開発業務を担当いただきます。 ・FCLGA、FCCSP、BGAなどの先端パッケージ技術の開発・評価 ・組立工程（ソルダーペースト印刷、部品実装、FC Bond、リフロー工程、フラックス洗浄工程）のプロセス開発、改善 ・製造ラインの立ち上げ・量産移行支援 ・工程の品質・歩留まり改善活動 ※就業場所の変更の範囲、従事すべき業務の変更の範囲については、選考時に詳細をお伝えいたします。 Qualifications: 【MUST】 ・半導体後工程（組立・パッケージング）の技術開発経験（4年以上） ・SMT工程の技術開発経験者（4年以上） ・工程改善・品質管理・設備導入などの実務経験 ・技術系学位（機械、材料、電子、化学など） 【WANT】 ・FCPackageや高密度パッケージ向けプロセス開発・評価経験 ・AI/HPC向けパッケージの開発経験（高信頼性設計） ・車載・IoT向けパッケージの信頼性試験・規格対応経験 ・ISO/IATFなど品質規格への対応経験 Additional Information: ルネサスは、「 To Make Our Lives Easier 」（人々の暮らしを楽“ラク”にする）というPurposeの下、組み込み半導体ソリューションを提供します。高品質とシステムレベルノウハウを兼ね備えた組み込み半導体のリーダーとして、自動車、産業、インフラ・IoT分野向けに、ハイパフォーマンスコンピューティング、組み込みプロセッシング、アナログ＆コネクティビティ、そしてパワーを含めた幅広い製品ポートフォリオを軸とした、スケーラブルで包括的なソリューションを提供しています。 ルネサスは、30か国以上で22,000 人を超える多様性あふれる従業員と共に、限界に挑戦しながら、デジタライゼーションを通じてユーザエクスペリエンスを充実化させ、新たなイノベーションの時代を切り開いていきます。そして世界中の人々やコミュニティの未来のために、持続可能で省エネ効果の高いソリューションの開発に全力で取り組み、「 To Make Our Lives Easier 」を実現します。 ルネサスで実現できること キャリアをスタート、そしてキャリアアップ： 4つのプロダクトグループをはじめ、さまざまな部門において技術職として、また幅広いビジネスの経験を積むことができます。ハードウェア、ソフトウェアの専門知識を深めたり、新しいことにチャレンジしたりする機会があります。 やりがいとインパクトのある仕事をする： 革新的な製品とソリューションの開発に関わることにより、世界中のお客様のニーズに応えると同時に、人々の生活をより便利で安全かつ安心なものにすることに貢献できます。 「ウェルビーイング」に焦点を置いた環境で最大限に能力を発揮する： ルネサスでは、リモートワーク制度などによる柔軟な勤務体制づくり、また従業員リソースグループの積極的な活動をサポートするなど、インクルーシブな職場環境構築を目指しています。従業員を第一に考えたカルチャーとグローバルなサポート体制が、入社後すぐに活躍できる環境を提供します。 自分の力で成功を掴み、キャリアを築く準備はできていますか？ ルネサスで一緒に 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"https://jobs.smartrecruiters.com/RenesasElectronics/744000113142987--", "apply_url_verified": false, "ats": "smartrecruiters", "url_last_checked_alive": null, "removed_at": null, "description_excerpt": "半導体組立工程 技術開発エンジニア Nakatsu, , Japan Company Description: Job Description: 【 募集背景 】 当社では、次世代パッケージ技術（Flip Chip、SiP など）の開発を中心に、半導体後工程における技術革新を積極的に推進しています。 特に AI・高性能コンピューティング（HPC）、車載、IoT 分野においては、より高密度・高信頼性・高放熱性を備えたパッケージ技術が求められており、FCCSP（Flip Chip Chip Scale Package）や FCBGA などの開発が加速しています。 今後、デバイスの複雑化や多機能化が一層進む中で、技術領域の拡大と開発体制の強化が不可欠です。 こうした状況を踏まえ、当社では半導体後工程に関する技術経験をお持ちのエンジニアを新たに募集しています。 本ポジションでは、AI/HPC向けの高密度・高放熱パッケージ、車載・IoT向けの高信頼性パッケージなど、業界最先端の技術開発に携わることができます。 AIや自動運転など、社会を大きく変革する技術を根幹から支えるパッケージ技術の開発に貢献できる、非常にやりがいのある環境です。 【 主な業務内容 】 半導体後工程（アセンブリ・パッケージング・テスト）における技術開発業務を担当いただきます。 ・FCCSP、FCBGAなどの先端パッケージ技術の開発・評価 ・組立工程（Molding 、Strip Grinding 、Ball mount、Mark、PKG saw）の材料、プロセス開発、改善 ・製造ラインの立ち上げ・量産移行支援 ・工程の品質・歩留まり改善活動 ※就業場所の変更の範囲、従事すべき業務の変更の範囲については、選考時に詳細をお伝えいたします。 Qualifications: 【MUST】 ・半導体後工程（組立・パッケージング）の技術開発経験（5年以上） ・Molding/Strip Grinding/PKG sawの何れかの工程の技術開発経験者（5年以上） ・工程改善・品質管理・設備導入などの実務経験 ・技術系学位（機械、材料、電子、化学など） 【WANT】 ・AI/HPC向けパッケージの開発経験（高信頼性設計） ・FCBGA/FCCSP/FCLGAパッケージの開発経験 ・ISO/IATFなど品質規格への対応経験 Additional Information: 本ポジションにご興味をお持ちの方は、以下の連絡先までお気軽にご連絡ください。 If you are interested in this position, please feel free to contact us at the details below: Recruiter: Nichika Higa ( linkedin.com/in/nichika-higa-30aa45240 ) ルネサスは、「 To Make Our Lives Easier 」（人々の暮らしを楽“ラク”にする）というPurposeの下、組み込み半導体ソリューションを提供します。高品質とシステムレベルノウハウを兼ね備えた組み込み半導体のリーダーとして、自動車、産業、インフラ・IoT分野向けに、ハイパフォーマンスコンピューティング、組み込みプロセッシング、アナログ＆コネクティビティ、そしてパワーを含めた幅広い製品ポートフォリオを軸とした、スケーラブルで包括的なソリューションを提供しています。 ルネサスは、30か国以上で22,000 人を超える多様性あふれる従業員と共に、限界に挑戦しながら、デジタライゼーションを通じてユーザエクスペリエンスを充実化させ、新たなイノベーションの時代を切り開いていきます。そして世界中の人々やコミュニティの未来のために、持続可能で省エネ効果の高いソリューションの開発に全力で取り組み、「 To Make Our Lives Easier 」を実現します。 ルネサスで実現できること キャリアをスタート、そしてキャリアアップ： 4つのプロダクトグループをはじめ、さまざまな部門において技術職として、また幅広いビジネスの経験を積むことができます。ハードウェア、ソフトウェアの専門知識を深めたり、新しいことにチャレンジしたりする機会があります。 やりがいとインパクトのある仕事をする： 革新的な製品とソリューションの開発に関わることにより、世界中のお客様のニーズに応えると同時に、人々の生活をより便利で安全かつ安心なものにすることに貢献できます。 「ウェルビーイング」に焦点を置いた環境で最大限に能力を発揮する： ルネサスでは、リモートワーク制度などによる柔軟な勤務体制づくり、また従業員リソースグループの積極的な活動をサポートするなど、インクルーシブな職場環境構築を目指しています。従業員を第一に考えたカルチャーとグローバルなサポート体制が、入社後すぐに活躍できる環境を提供します。 自分の力で成功を掴み、キャリアを築く準備はできていますか？ ルネサスで一緒に 未来を形づくっていきましょう 。 当社では、ハイブリッド勤務モデルを採用しており、従業員は週に2日間リモートワークを行うことができます。同時に、残りの日はチームとしてオフィスに集まり、協働を強化しています。出社指定日は火曜日から木曜日で、イノベーション、コラボレーション、そして継続的な学習に取り組む日としています。", "parental_leave_weeks": null, "non_birth_parent_leave_weeks": null, "parental_leave_weeks_source": null, "non_birth_parent_leave_weeks_source": null, "parental_leave_source_url": null, "pto_days": null, "unlimited_pto": false, "sabbatical_eligible": false, "family_friendly_score": 40, "benefit_verified": false, "benefit_last_verified": null, "hire_states_allowed": [], "state_eligibility_source": null, 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false, "security_clearance": "none", "education_required": "none", "roll_up_count": null, "roll_up_total_locations": null, "explanations": [ { "schema_version": "inv382.match_signal.v1", "signal_id": "sig.query.description_excerpt.38042773006fd26cb3", "query_id": "gq_156c4a1ac40416cad8ae", "job_id": "157e8964ffcfb8e6b9d574b0bd970ef1", "signal_type": "query_match", "display_text": "Description: \"flip\"", "tooltip": "Description matched \"flip\" from your search.", "source_binding": "bm25_field_evidence", "source_field": "description_excerpt", "source_value": "半導体組立工程 技術開発エンジニア Nakatsu, , Japan Company Description: Job Description: 【 募集背景 】 当社では、次世代パッケージ技術（Flip Chip、SiP など）の開発を中心に、半導体後工程における技術革新を積極的に推進しています。 特に AI・高性能コンピューティング（HPC）、車載、IoT 分野においては、より高密度・高信頼性・高放熱性を備えたパッケージ技術が求められており、FCCSP（Flip Chip Chip Scale Package）や FCBGA などの開発が加速しています。 今後、デバイスの複雑化や多機能化が一層進む中で、技術領域の拡大と開発体制の強化が不可欠です。 こうした状況を踏まえ、当社では半導体後工程に関する技術経験をお持ちのエンジニアを新たに募集しています。 本ポジションでは、AI/HPC向けの高密度・高放熱パッケージ、車載・IoT向けの高信頼性パッケージなど、業界最先端の技術開発に携わることができます。 AIや自動運転など、社会を大きく変革する技術を根幹から支えるパッケージ技術の開発に貢献できる、非常にやりがいのある環境です。 【 主な業務内容 】 半導体後工程（アセンブリ・パッケージング・テスト）における技術開発業務を担当いただきます。 ・FCCSP、FCBGAなどの先端パッケージ技術の開発・評価 ・組立工程（Molding 、Strip Grinding 、Ball mount、Mark、PKG saw）の材料、プロセス開発、改善 ・製造ラインの立ち上げ・量産移行支援 ・工程の品質・歩留まり改善活動 ※就業場所の変更の範囲、従事すべき業務の変更の範囲については、選考時に詳細をお伝えいたします。 Qualifications: 【MUST】 ・半導体後工程（組立・パッケージング）の技術開発経験（5年以上） ・Molding/Strip Grinding/PKG sawの何れかの工程の技術開発経験者（5年以上） ・工程改善・品質管理・設備導入などの実務経験 ・技術系学位（機械、材料、電子、化学など） 【WANT】 ・AI/HPC向けパッケージの開発経験（高信頼性設計） ・FCBGA/FCCSP/FCLGAパッケージの開発経験 ・ISO/IATFなど品質規格への対応経験 Additional Information: 本ポジションにご興味をお持ちの方は、以下の連絡先までお気軽にご連絡ください。 If you are interested in this position, please feel free to contact us at the details below: Recruiter: Nichika Higa ( linkedin.com/in/nichika-higa-30aa45240 ) ルネサスは、「 To Make Our Lives Easier 」（人々の暮らしを楽“ラク”にする）というPurposeの下、組み込み半導体ソリューションを提供します。高品質とシステムレベルノウハウを兼ね備えた組み込み半導体のリーダーとして、自動車、産業、インフラ・IoT分野向けに、ハイパフォーマンスコンピューティング、組み込みプロセッシング、アナログ＆コネクティビティ、そしてパワーを含めた幅広い製品ポートフォリオを軸とした、スケーラブルで包括的なソリューションを提供しています。 ルネサスは、30か国以上で22,000 人を超える多様性あふれる従業員と共に、限界に挑戦しながら、デジタライゼーションを通じてユーザエクスペリエンスを充実化させ、新たなイノベーションの時代を切り開いていきます。そして世界中の人々やコミュニティの未来のために、持続可能で省エネ効果の高いソリューションの開発に全力で取り組み、「 To Make Our Lives Easier 」を実現します。 ルネサスで実現できること キャリアをスタート、そしてキャリアアップ： 4つのプロダクトグループをはじめ、さまざまな部門において技術職として、また幅広いビジネスの経験を積むことができます。ハードウェア、ソフトウェアの専門知識を深めたり、新しいことにチャレンジしたりする機会があります。 やりがいとインパクトのある仕事をする： 革新的な製品とソリューションの開発に関わることにより、世界中のお客様のニーズに応えると同時に、人々の生活をより便利で安全かつ安心なものにすることに貢献できます。 「ウェルビーイング」に焦点を置いた環境で最大限に能力を発揮する： ルネサスでは、リモートワーク制度などによる柔軟な勤務体制づくり、また従業員リソースグループの積極的な活動をサポートするなど、インクルーシブな職場環境構築を目指しています。従業員を第一に考えたカルチャーとグローバルなサポート体制が、入社後すぐに活躍できる環境を提供します。 自分の力で成功を掴み、キャリアを築く準備はできていますか？ ルネサスで一緒に 未来を形づくっていきましょう 。 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"reranker_semantic_evidence", "source_field": "description_excerpt", "source_value": "半導体組立工程 技術開発エンジニア Nakatsu, , Japan Company Description: Job Description: 【 募集背景 】 当社では、次世代パッケージ技術（Flip Chip、SiP など）の開発を中心に、半導体後工程における技術革新を積極的に推進しています。 特に AI・高性能コンピューティング（HPC）、車載、IoT 分野においては、より高密度・高信頼性・高放熱性を備えたパッケージ技術が求められており、FCCSP（Flip Chip Chip Scale Package）や FCBGA などの開発が加速しています。 今後、デバイスの複雑化や多機能化が一層進む中で、技術領域の拡大と開発体制の強化が不可欠です。 こうした状況を踏まえ、当社では半導体後工程に関する技術経験をお持ちのエンジニアを新たに募集しています。 本ポジションでは、AI/HPC向けの高密度・高放熱パッケージ、車載・IoT向けの高信頼性パッケージなど、業界最先端の技術開発に携わることができます。 AIや自動運転など、社会を大きく変革する技術を根幹から支えるパッケージ技術の開発に貢献できる、非常にやりがいのある環境です。 【 主な業務内容 】 半導体後工程（アセンブリ・パッケージング・テスト）における技術開発業務を担当いただきます。 ・FCCSP、FCBGAなどの先端パッケージ技術の開発・評価 ・組立工程（Molding 、Strip Grinding 、Ball mount、Mark、PKG saw）の材料、プロセス開発、改善 ・製造ラインの立ち上げ・量産移行支援 ・工程の品質・歩留まり改善活動 ※就業場所の変更の範囲、従事すべき業務の変更の範囲については、選考時に詳細をお伝えいたします。 Qualifications: 【MUST】 ・半導体後工程（組立・パッケージング）の技術開発経験（5年以上） ・Molding/Strip Grinding/PKG sawの何れかの工程の技術開発経験者（5年以上） ・工程改善・品質管理・設備導入などの実務経験 ・技術系学位（機械、材料、電子、化学など） 【WANT】 ・AI/HPC向けパッケージの開発経験（高信頼性設計） ・FCBGA/FCCSP/FCLGAパッケージの開発経験 ・ISO/IATFなど品質規格への対応経験 Additional Information: 本ポジションにご興味をお持ちの方は、以下の連絡先までお気軽にご連絡ください。 If you are interested in this position, please feel free to contact us at the details below: Recruiter: Nichika Higa ( linkedin.com/in/nichika-higa-30aa45240 ) ルネサスは、「 To Make Our Lives Easier 」（人々の暮らしを楽“ラク”にする）というPurposeの下、組み込み半導体ソリューションを提供します。高品質とシステムレベルノウハウを兼ね備えた組み込み半導体のリーダーとして、自動車、産業、インフラ・IoT分野向けに、ハイパフォーマンスコンピューティング、組み込みプロセッシング、アナログ＆コネクティビティ、そしてパワーを含めた幅広い製品ポートフォリオを軸とした、スケーラブルで包括的なソリューションを提供しています。 ルネサスは、30か国以上で22,000 人を超える多様性あふれる従業員と共に、限界に挑戦しながら、デジタライゼーションを通じてユーザエクスペリエンスを充実化させ、新たなイノベーションの時代を切り開いていきます。そして世界中の人々やコミュニティの未来のために、持続可能で省エネ効果の高いソリューションの開発に全力で取り組み、「 To Make Our Lives Easier 」を実現します。 ルネサスで実現できること キャリアをスタート、そしてキャリアアップ： 4つのプロダクトグループをはじめ、さまざまな部門において技術職として、また幅広いビジネスの経験を積むことができます。ハードウェア、ソフトウェアの専門知識を深めたり、新しいことにチャレンジしたりする機会があります。 やりがいとインパクトのある仕事をする： 革新的な製品とソリューションの開発に関わることにより、世界中のお客様のニーズに応えると同時に、人々の生活をより便利で安全かつ安心なものにすることに貢献できます。 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